A method for manufacturing a composite glass substrate of a monochromatic epitaxial LED display module
A technology for display modules and composite glass, applied in the semiconductor field, can solve the problems of high cost, impact on product performance, cumbersome bonding process, etc., and achieve the effect of low cost, good consistency, and guaranteed consistency
Active Publication Date: 2018-12-21
无锡极目科技有限公司
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Problems solved by technology
[0003] However, when the traditional circuit board is used as the LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability.
Moreover, when the resolution of the semiconductor display is increased to a certain extent (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized.
Therefore, traditional circuit boards are completely unable to meet the requirements of small size and high precision.
At the same time, the subsequent bonding process with LEDs is cumbersome, resulting in high costs, and the consistency of performance among multiple LED chips carried by an LED circuit substrate cannot be guaranteed, which may affect the performance of the final product
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[0022] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
[0023] The manufacturing method of the composite glass substrate of the monochromatic epitaxial LED display module of the present invention is mainly used for LED display screens, ultra-fine-pitch LED display screens, ultra-high-density LED display screens, LED positive-emitting TVs, and LED positive-emitting monitors , LED video wall, LED indication, LED special lighting and other fields of display panel manufacturing.
[0024] figure 1 It is a flowchart of a method for manufacturing a composite glass substrate of a monochromatic epitaxial LED display module provided by an embodiment of the present invention. Manufacturing method of the present invention comprises the steps:
[0025] Step 101, processing the glass template, making a plurality of matrix columns of equal size, height and spacing on one side of the gla...
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The invention relates to a method for manufacturing a composite glass substrate of a monochromatic epitaxial LED display module. The method comprises: processing a glass template to make multiple matrix columns equal in size, height and spacing in one lateral surface of the glass template; drilling a SiC liner to obtain multiple stepped holes, align-assembling to the matrix columns of the glass template, and inserting each matrix column from one small-diameter side of the corresponding stepped hole into the corresponding stepped hole; hot-pressing the glass template mounted in the SIC liner at high temperature so that the SiC liner is bonded to the glass template; after cooling, grinding and polishing one surface of the glass template with the SiC liner mounted; obtaining the composite glass substrate after high-temperature annealing and washing.
Description
technical field [0001] The invention relates to the field of semiconductors, in particular to a method for manufacturing a composite glass substrate of a monochrome epitaxy LED display module. Background technique [0002] With the development of traditional semiconductor display products to this day, supporting or cross-industry resources have been greatly enriched and perfected. In the traditional LED product structure, FR4 circuit boards are usually used as LED circuit substrates. [0003] However, when the traditional circuit board is used as the LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability. Moreover, when the resolution of the semiconductor display is increased to a certain extent (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized. Therefore, traditional circuit boards are complete...
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IPC IPC(8): G09F9/33
Inventor 严敏程君周鸣波
Owner 无锡极目科技有限公司