Photosensitive resin composition and cured product thereof

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition and its cured product, can solve the problems of insufficient developing property, heat resistance and adhesiveness, etc., and achieve the effect of excellent sensitivity

Active Publication Date: 2020-07-28
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, in Patent Document 2, a photosensitive resin composition using a biphenol-type epoxy resin (for example, Nippon Kayaku NC-3000, etc.) as a hardener is described, but sufficient developability, heat resistance and adhesion cannot be obtained. sex

Method used

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  • Photosensitive resin composition and cured product thereof
  • Photosensitive resin composition and cured product thereof
  • Photosensitive resin composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0089] In a 3L flask equipped with a stirring device and a reflux tube, add Nippon Kayaku (Stock) EOCN-103S (multifunctional cresol novolak type epoxy resin, epoxy equivalent: 215.0g / equivalent) 860.0g as in the molecule Epoxy compound (a) having two or more epoxy groups, 288.3 g of acrylic acid (molecular weight: 72.06) as monocarboxylic acid (b) having an ethylenically unsaturated group in the molecule, 492.1 g of carbitol acetate As a reaction solvent, 4.921 g of 2,6-di-tert-butyl-p-cresol as a polymerization inhibitor, and 4.921 g of triphenylphosphine as a reaction catalyst, react at 98°C until the acid value of the reaction liquid becomes 0.5 mg·KOH / g or less, the epoxy carboxylate compound can be obtained. Then, 169.8 g of carbitol acetate as a reaction solvent and 201.6 g of tetrahydrophthalic anhydride as a polybasic acid anhydride (c) were added to the reaction liquid, and reacted at 95° C. for 4 hours to obtain a soluble resin containing an aqueous alkali solution (...

Synthetic example 2

[0091] In a 1L flask equipped with a stirring device and a reflux tube, add 209.0 g of NC-3500 (biphenol type epoxy resin, epoxy equivalent: 209.0 g / equivalent) manufactured by Nippon Kayaku Co., Ltd. The above epoxy compound (a), acrylic acid (molecular weight: 72.06) 72.06g as a monocarboxylic acid (b) having an ethylenically unsaturated group in the molecule, and 121.39g of carbitol acetate for the reaction Solvent, 0.850g of 2,6-di-tert-butyl-p-cresol as a polymerization inhibitor, and 0.850g of triphenylphosphine as a reaction catalyst, react at 98°C until the acid value of the reaction solution becomes 0.5mg·KOH / g or less, an epoxy carboxylate compound is produced. Then, 86.32 g of carbitol acetate as a reaction solvent and 102.51 g of tetrahydrophthalic anhydride as a polybasic acid anhydride (c) were added to the reaction liquid, and reacted at 95° C. for 4 hours to obtain a soluble resin containing an aqueous alkali solution ( A1') 65% by mass resin solution (let th...

Synthetic example 3

[0093] In a 3L flask equipped with a stirring device and a reflux tube, add 368.0 g of RE-310S (2-functional bisphenol-A epoxy resin, epoxy equivalent: 184.0 g / equivalent) manufactured by Nippon Kayaku (Co., Ltd.) as the molecule Epoxy compound (d) having two or more epoxy groups, 141.2 g of acrylic acid (molecular weight: 72.06) as monocarboxylic acid (b) having an ethylenically unsaturated group in the molecule, hydroquinone monomethyl ether 1.02 g as a polymerization inhibitor, and 1.53 g of triphenylphosphine as a reaction catalyst, react at 98°C until the acid value of the reaction solution becomes below 0.5 mg·KOH / g to obtain an epoxy carboxylate compound (molecular weight: 509.2) . Then, 755.5 g of carbitol acetate and 268.3 g of 2,2-bis(dimethylol)-propionic acid (molecular weight: 134.16) were added as a solvent for the reaction to this reaction liquid as a solvent having two The carboxylic acid (f) of the hydroxyl group, 1.08 g of 2-methylhydroquinone as a thermal p...

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Abstract

Provided is a photosensitive resin composition which exhibits excellent photosensitivity, flexibility, adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, and plating resistance. Also provided is a cured product comprising the same. To this end, the photosensitive resin composition contains (A) an alkali aqueous solution-soluble resin, (B) a cross-linking agent, (C) a photopolymerization initiator, and (D) an epoxy resin represented by chemical formula 1. In the chemical formula 1, the value of (i) / (ii) is 1-3, and G represents a glycidyl group, whereas n is an average value of a repetition number ranging from 0 to 5.

Description

technical field [0001] This invention relates to the photosensitive resin composition containing an epoxy resin etc., and its cured product. Background technique [0002] A photosensitive resin composition using a photosensitive epoxy carboxylate compound is excellent in the balance of various properties such as environmental, thermal, mechanical properties, and adhesion to substrates. Therefore, it has been used for a long time in the fields of paint / coating, adhesives, and the like. Recently, it is also used in a wide range of industrial fields such as electrical / electronic component manufacturing applications and printed circuit board manufacturing applications, and its application range is gradually expanding. With the expansion of this application range, high functions such as flexibility, low warpage, and low water absorption are required for photosensitive resin compositions using epoxy carboxylate compounds, and are used for electrical / electronic parts manufacturing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004
Inventor 山本和义长谷川笃彦小渊香津美
Owner NIPPON KAYAKU CO LTD
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