1results about How to "Full adhesion" patented technology

This invention provides a polyimide using a dimerized diamine as a raw material, capable of forming a resin film with both low dielectric loss tangent and excellent adhesion. The polyimide contains, relative to all diamine residues, diamine residues derived from a dimerized diamine composition in the range of 40 mol% to 95 mol%, wherein the dimerized diamine composition is primarily composed of a dimerized diamine formed by replacing the two terminal carboxylic acid groups of a dimer acid with primary aminomethyl or amino groups, and contains, in the range of 5 mol% to 25 mol%, diamine residues derived from a diamine compound comprising a biphenyl backbone or a naphthalene backbone, wherein the biphenyl backbone or the naphthalene backbone has at least one substituent containing an intercarbon double bond selected from the group consisting of vinyl, acrylate, methacrylate, and allyl groups.