Adhesive sheet for processing semiconductor wafers and/or substrates

A technology for semiconductors and adhesive sheets, applied in semiconductor/solid-state device manufacturing, semiconductor devices, film/sheet-like adhesives, etc., which can solve the problems of peeling, no reduction, and residual sealing resin paste.

Active Publication Date: 2008-04-23
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Therefore, due to such a change in the sealing resin or the like used in the semiconductor wafer and / or the substrate as the adherend, when only the specific tackifier proposed in Patent Document 3 is used, regeneration cannot be completely prevented at the time of cutting. This bad situation where chips fly out
[0010] In addition, the type of sealing resin and / or additives in the adherend, or the amount of release agent (such as wax) usually coated on the surface of the sealing resin is too small or uneven, such inappropriate conditions, etc., the adhesive layer The adhesive force does not decrease to the specified value after irradiating ultraviolet rays, and sometimes a single sheet cannot be picked up in the picking process
Due to poor pick-up, peeling from the inside of the sealing resin occurs, and paste residues remain on the entire surface of the sealing resin.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] A resin solution as an adhesive layer was prepared in conjunction with the addition of the following substances, which were 100 parts by weight of 20 parts by weight of methyl acrylate, 10 parts by weight of acrylic acid and 80 parts by weight of 2-ethylhexyl acrylate. The obtained weight average molecular weight of 800,000 copolymer (solid content 35%), 100 parts by weight of polyfunctional acrylate oligomer (UV-1700 manufactured by Nippon Synthetic Chemicals), and 15 parts by weight of the hydroxyl value as a tackifier 160-170KOHmg / g terpene phenolic resin (YS Polyster-N125 manufactured by Yasuhara Chemical Company), phosphate ester surfactant (manufactured by Toho Chemical Industry Co., Ltd., trade name Foosfuranol RL- 210, the number of carbon atoms of the alkyl group is 18) 0.4 parts (a solution that is dissolved in toluene heated to 50° C. with a solid content concentration of 2%), 1 part by weight of a polyisocyanate compound (trade name "Corone 一トL", manufactured...

Embodiment 2

[0067] When preparing the binder solution of Example 1, a terpene phenolic resin with a hydroxyl value of 200 to 210 KOHmg / g (Maytei Ace K125 manufactured by Yasuhara Chemical Co., Ltd.) was added instead of a terpene with a hydroxyl value of 160 to 170 KOHmg / g. Except having prepared an adhesive composition using phenolic resin as a tackifier, the same operation as in Example 1 was performed to prepare an adhesive sheet, and the evaluation shown below was implemented.

Embodiment 3

[0069] When preparing the binder solution of Example 1, a terpene phenolic resin with a hydroxyl value of 130 to 140 KOHmg / g (Mayteyes G125 manufactured by Yasuhara Chemical Co., Ltd.) was added instead of a terpene with a hydroxyl value of 160 to 170 KOHmg / g Except having prepared an adhesive composition using a phenolic resin as a tackifier, it carried out the same operation as Example 1, produced an adhesive sheet, and implemented the evaluation shown below.

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Abstract

An adhesive sheet of the present invention can be to lower the adhesive strength to the optimal level during pick up or the like after irradiation with UV rays and / or radiation, while maintaining adhesion with adherends before irradiation with UV rays and / or radiation by ensuring that, regardless of the texture on the surface of adherends such as semiconductor wafers and / or substrates, the adhering surface favorably conforms to the texture with preserving enough adhesive and cohesive strength. The adhesive sheet for processing semiconductor wafers and / or substrates comprises a UV- and / or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and / or radiation, wherein the adhesive layer comprises at least a tackifier and a surfactant.

Description

technical field [0001] The present invention relates to an adhesive sheet for semiconductor wafer and / or substrate processing, and more specifically, to an adhesive sheet for semiconductor wafer and / or substrate processing having a substrate and an adhesive layer containing a specific component. Background technique [0002] Conventionally, when a semiconductor wafer and / or substrate is diced and unfolded, and then mounted while picking up the semiconductor wafer and / or substrate, a semiconductor wafer and / or substrate processing sheet is used to fix the semiconductor wafer and / or substrate. [0003] In such a sheet, an adhesive layer that undergoes a polymerization and curing reaction by ultraviolet rays and / or radiation is coated on a base material that is transparent to ultraviolet rays and / or radiation, and after cutting, the adhesive layer is irradiated with ultraviolet rays. And / or radiation, the adhesive layer undergoes polymerization and curing reaction, the adhesive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/38
CPCC09J11/06H01L21/6836C09J7/0207C09J11/08H01L2221/68327H01L21/67005C09J2203/326H01L21/67132C09J2433/00C09J2205/31C09J2205/102C09J7/38Y10T428/31855C09J2301/416C09J2301/408H01L21/68
Inventor 新谷寿朗山本晃好浅井文辉桥本浩一
Owner NITTO DENKO CORP
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