Wafer working tape

Abstract

Provided is a wafer working tape wherein a support substrate, an adhesion layer, and a single binding layer are stacked in this order. The binding layer is used for pressure adhesion of a semiconductor element to either an external contact wiring member with wiring or another semiconductor element. The difference in surface free energy between the face of the binding layer which has detached from the adhesion layer and the face of the binding layer which is not in contact with the adhesion layer is 10 mJ / m2 or less.

Description

technical field [0001] The present invention relates to tapes for wafer processing. Background technique [0002] In the manufacturing process of semiconductor devices, the process of cutting (dicing) silicon wafers into chip units, picking up the cut semiconductor elements (chips), and then performing chip bonding on the picked up chips and lead frames and packaging substrates ( assembly) process. As a wafer processing tape used in the manufacturing process of the above-mentioned semiconductor device, a dicing tape in which an adhesive layer (temporary-adhesive layer) and an adhesive layer (adhesive layer) are sequentially formed on a support base material has been known in recent years. Die-bonding sheet (for example, see Patent Document 1). [0003] For a wafer processing tape in which an adhesive layer and an adhesive layer are sequentially formed on a substrate in this way, the contact time between the adhesive layer and the adhesive layer must be long between manufac...

AI Technical Summary

Problems solved by technology

[0003] For a wafer processing tape in which an adhesive layer and an adhesive layer are sequentially formed on a substrate in this way, the contact time between the adhesive layer and the adhesive layer must be long between manufacture and use. Therefore, the two layers are fused before use, and there is a problem that the adhesive layer cannot be peeled off smoothly from the adhesive layer in the process of picking up the singulated semiconductor element with the adhesive layer.

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