Positive type photosensitive composition

A photosensitive composition, positive type technology, applied in the directions of optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc. Film and other problems, to achieve the effect of less film reduction, improved scratch resistance, and small change rate

Inactive Publication Date: 2006-06-21
THINK LABORATORY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the test without baking treatment, good film formation and poor development were not possible.
[0021] Even if the baking temperature can be lowered to around 50°C, baking is still necessary, which requires cooling after baking, time and energy for baking and cooling after baking, installation lines make the baking part longer, and equipment costs and smelting costs have become higher, these have become disadvantages and problems

Method used

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  • Positive type photosensitive composition
  • Positive type photosensitive composition
  • Positive type photosensitive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0142] A positive-type photosensitive composition (5% solid content) was prepared as a photosensitive liquid for measurement according to the blended substances and the blending ratio shown in Table 1.

[0143] Complex substance

Compounding amount

(parts by weight)

ingredient (A)

Novolac resin

100

ingredient (B)

Near Infrared Absorbing Pigment 1

1

ingredient (C)

PVP / VA copolymer

5

ingredient (D)

Solvolysis inhibitor 1

5

solvent

PM

IPA

MEK

800

800

600

[0144] Each component in Table 1 is as follows.

[0145] Novolak resin: PR-NMD-100 (manufactured by Sumitomo Bakerite Co., Ltd.)

[0146] Light-absorbing pigment 1: Anthocyanin-based pigment PVP / VA copolymer: a copolymer of vinylpyrrolidone and vinyl acetate with a molecular weight of 46,000 and a glass transition temperature of 96°C (vinylpyrrolidone / vinyl acetate 50 / 50)

[0147] Dissolutio...

Embodiment 2～6

[0177] As shown in Table 4, it tested similarly to Example 1 except having changed the component (B) in a composition. In addition, it is a test performed under the measurement condition of 45% of humidity. The results are shown in Table 4 together.

[0178] Element

[0179] The compounding quantity of the component (B) in Table 4 is the same as that of Example 1, and the dyes 2 to 6 are compounds represented by the aforementioned formulas (2), (4) to (7), respectively.

Embodiment 7～9

[0181] As shown in Table 5, it tested similarly to Example 1 except having changed (A) component in a composition. In addition, it is a test performed under the measurement condition of 45% of humidity. The results are shown in Table 5 together.

[0182] Element

(A)

Adhesion

Sensitivity

(mJ / cm 2 )

development

(second)

Residual film rate

(%)

image

Marginal

clarity

development

scope

Example 7

Resin 1

◎

220

75

72

◎

◎

◎

Example 8

Resin 2

◎

220

75

74

◎

◎

◎

Example 9

Resin 3

◎

220

75

75

◎

◎

◎

[0183] In Table 5, the compounding quantity of a component (A) is the same as Example 1, and resins 2-4 are as follows.

[0184] Resin 1: Alkylphenolic resin (trade name Hitano-ru 2181, manufactured by Hitachi Chemical Co., Ltd.)

[0185] Resin 2: p...

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Abstract

A positive photosensitive composition which comprises (A) an alkali-soluble organic polymer substance having a phenolic hydroxyl group, (B) a light-heat conversion substance absorbing an infrared ray of an image exposure light source and converting it to heat, (C) at least one resin selected from the group consisting of a vinyl pyrrolidone / vinyl acetate copolymer and other specific polymers or resins, and (D) a dissolution inhibiting agent. The positive photosensitive composition does not require burning, provides necessary and sufficient adhesion in an application under a condition of a humidity in a working room of 25 to 60 %, allows the development which retains high sensitivity and is free of a residue, forms an image having a sharp outline, and provides a resist film which is so hard that its resistance to flawing is improved in the handling before development.

Description

technical field [0001] The invention relates to an alkali-soluble positive-type photosensitive composition, which is exposed and sensed under a laser with a wavelength of 700-1100 nm, and the sensitive part is soluble in an alkaline developing solution and has laser sensitivity in an infrared wavelength range. The positive photosensitive composition of the present invention is particularly used in the field of photochemical etching manufacturing methods of printing plates, electronic parts, precision instrument parts and the like. Background technique [0002] The method of using a laser with a wavelength of 700-1100nm to develop and image a positive-type photosensitive composition is a method of increasing the solubility of the developer in the exposed part through changes other than chemical changes, thereby forming a positive image. attention (for example, refer to Patent Documents 1 to 9, etc.). [0003] The positive-type photosensitive composition for forming a lithogr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039B41C1/10B41M5/36G03F7/00G03F7/004
CPCB41C1/1008B41M5/368B41C2210/02B41C2210/06B41C2210/22B41C2210/24B41C2210/26B41C2210/262
Inventor 佐藤勉
Owner THINK LABORATORY CO LTD
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