Adhesive film and method for manufacturing semiconductor device using same

Abstract

Disclosed is an adhesive tape serving as a dicing tape in a dicing step which has excellent dicing properties and pick-up properties. Also disclosed is a bonding tape exhibiting excellent bonding reliability in a step for bonding a semiconductor element and a supporting member. Specifically disclosed is an adhesive film including a layer wherein an adhesive layer (A) containing an olefin polymer and another adhesive layer (B) are directly joined together. The adhesive film is characterized in that the 180 DEG peel strength between the layer (A) and the layer (B) is not more than 0.7 N / 10 mm.

Description

technical field

[0001] The present invention relates to an adhesive film used for manufacturing semiconductor devices such as ICs and LSIs, and a method of using the same. Background technique

[0002] Semiconductor wafers such as silicon and gallium arsenide are produced in a large-diameter state, and the wafers are diced (daising) into IC chips, followed by a die-attach process in which the IC chips are mounted on a lead frame for packaging as the next step. (die attach or chip bonding). At this time, the semiconductor wafer is cut, cleaned, dried, expanded, and picked up in the state where the adhesive sheet is pasted in advance, and then transferred to the next step of the die bonding process. As the adhesive sheet used in the process from the dicing process to the pick-up process of such a semiconductor wafer, it is preferable to have sufficient adhesion to the wafer chip in the dicing process to the drying process, and to have no adhesion to the wafer chip at the time...

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