Circuit board with embedded element and manufacturing method thereof
A technology of embedded components and manufacturing methods, which can be applied to printed circuits connected with non-printed electrical components, printed circuits assembled with electrical components, multi-layer circuit manufacturing, etc., which can solve problems such as circuit board deformation and affecting the quality of circuit boards , to reduce warpage and improve production yield
Inactive Publication Date: 2016-04-27
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
When the existing embedded multi-layer circuit board mounts the embedded electronic components, solder paste electronic components need to be welded into the circuit board through reflow soldering, because the temperature in the reflow furnace is high, it is easy to cause deformation of the circuit board , thus affecting the board quality
Method used
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Embodiment Construction
[0017] see figure 1 , the first embodiment of the present invention provides a multilayer circuit board 100 with embedded components, including: a core circuit board 10, electronic components 17 accommodated in the core circuit board 10, forming and core circuit board 10 The first film 181 and the second film 191 on both sides, the third conductive circuit layer 22 formed on the first film 181 side, and the fourth conductive circuit layer 23 formed on the second film 191 side.
[0018] The core circuit board 10 includes a substrate layer 11, and a first conductive circuit layer 121 and a second conductive circuit layer 131 arranged on opposite sides of the substrate layer 11, and a conductive via 141 is electrically connected to the first conductive circuit layer 131. The circuit layer 121 and the second conductive circuit layer 131 have a mounting hole 16 passing through the core circuit board 10 .
[0019] The electronic component 17 is accommodated in the installation hole...
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The invention provides a multilayer circuit board with an embedded element, which comprises a core-layer circuit board, an electronic part, a first film, a second film and a conductive circuit layer, wherein a through mounting hole is formed in the core-layer circuit board; the electronic part is accommodated in the mounting hole; multiple conductive convex blocks are formed on the electrode of the electronic part; the sectional areas of the conductive convex blocks in the direction far away from the electrode from the electrode are gradually decreased; the first film and the second film are formed respectively at opposite two sides of the core-layer circuit board; the multiple conductive convex blocks pass through the first film; the conductive circuit layer is formed on the surface of the first film and the surface of the second film respectively; and the conductive convex blocks passing through the first film and the conductive circuit layer attached to the first film are contacted and electrically connected. The invention also relates to a method of manufacturing the above circuit board.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with embedded components and a production method thereof. Background technique [0002] In order to achieve the goal of lightness, lightness and shortness, various manufacturers have begun to devote themselves to changing the electronic components that were originally soldered on the surface of the multilayer circuit board to be buried inside the multilayer circuit board, so as to increase the wiring area on the surface of the circuit board and reduce the circuit size. Board size and reduce its weight and thickness, the electronic components can be active or passive components. When the existing embedded multilayer circuit board mounts the embedded electronic components, solder paste electronic components need to be welded into the circuit board through reflow soldering. Due to the high temperature in the reflow furnace, it is easy to cause deformation of t...
Claims
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IPC IPC(8): H05K3/32H05K3/46H05K1/18
Inventor 覃海波
Owner AVARY HLDG (SHENZHEN) CO LTD