Unlock instant, AI-driven research and patent intelligence for your innovation.

A method for controlling the uniformity of tin thickness of fpc tinned fingers and fpc

A technology of uniformity and fingers, which is applied in the direction of printed circuit manufacturing, printed circuits, cells, etc., can solve the problems of uneven tin thickness of FPC tinned fingers, and achieve the effect of promoting the use, uniform tin thickness and low cost

Active Publication Date: 2017-10-31
SHENZHEN KINWONG ELECTRONICS
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for controlling the uniformity of the tin thickness of FPC tinned fingers and FPC, aiming to solve the problem of uneven tin thickness of existing FPC tinned fingers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for controlling the uniformity of tin thickness of fpc tinned fingers and fpc
  • A method for controlling the uniformity of tin thickness of fpc tinned fingers and fpc
  • A method for controlling the uniformity of tin thickness of fpc tinned fingers and fpc

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention provides a method for controlling the tin thickness uniformity of FPC tinned fingers and FPC. In order to make the objectives, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0020] See figure 1 , figure 1 The method for controlling the uniformity of tin thickness of FPC tinned fingers provided by the present invention includes the steps:

[0021] S1. First connect the fingers on the scrap side of the whole board of the flexible circuit board into a circuit loop through the electroplating lead;

[0022] S2, then tin plating is performed according to the tin plating process.

[0023] The circuit loop formed by the present invention is a closed loop, and each circuit loop must be closed to be effective. In...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method used for controlling uniformity of the tin thickness of tin-plated fingers of a flexible printed circuit (FPC) and the FPC. The method comprises the step that the whole FPC is designed as a loop path, so that when tin is plated, the same current passes through each finger, the most similar electroplating chemical reaction is generated, and then the tin thickness of the tin-plated fingers is more uniform; meanwhile, the cost is lower, and usage and popularization are facilitated.

Description

Technical field [0001] The invention relates to the field of FPC, in particular to a method for controlling the uniformity of tin thickness of FPC tinned fingers and FPC. Background technique [0002] In the FPC (flexible circuit board) manufacturing process, poor finger tin thickness uniformity will directly lead to difficulties in subsequent press-screen assembly and production, resulting in loss of manpower and material resources, and increased production costs. In order to improve this defect, FPC technicians try to solve it in many ways, but most of them are solved in the process of product manufacturing, such as updating fixtures, replacing electroplating solutions, and even replacing better and more advanced production equipment. Although these schemes improve the uniformity more or less, they increase the production cost and are not conducive to popularization. [0003] Therefore, the existing technology needs to be improved and developed. Summary of the invention [0004]...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/12H05K1/11H05K3/40
CPCC25D21/12H05K1/118H05K3/403H05K2201/09409H05K2201/09427
Inventor 吴卫钟沈雷邹攀方董
Owner SHENZHEN KINWONG ELECTRONICS