Semiconductor package and manufacturing method thereof

Abstract

The invention discloses a semiconductor packaging part and a manufacturing method therefor. The method comprises the steps: firstly providing a bearing part with a plurality of grooves, and a plurality of carriers, wherein each carrier is provided with a plurality of electronic elements; enabling all carriers to be correspondingly placed in the grooves, and enabling all electronic elements to be higher than the bearing part; forming a packaging material on the bearing part, so as to cover the electronic elements; removing all carriers and the bearing part; and finally carrying out separation. Through the design of the carriers and the grooves, the whole layout structure is divided into packaging blocks in a needed size, and later, a conventional machine platform can be used for cutting, thereby saving the development cost of the machine platform.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor package, in particular to a semiconductor package with increased production capacity and a method for manufacturing the same. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. In order to meet the packaging requirements of miniaturization of semiconductor packages, a wafer level packaging (Wafer Level Packaging, WLP) technology has been developed. [0003] like Figure 1A to Figure 1E , which is a schematic cross-sectional view of a conventional wafer-level semiconductor package 1 manufacturing method. [0004] like Figure 1A As shown, a thermal release tape 11 is formed on a carrier 10 . [0005] Next, place a plurality of semiconductor elements 12 on the thermal release adhesive layer 11, these semiconductor elements 12 have opposite active surf...

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Problems solved by technology

[0012] However, in the current manufacturing method of semiconductor package 1, the current cutting machine can only place a maximum of 100mm×240mm, so it cannot place a size of 370mm×470mm or larger. Therefore, at this stage, manual cut into a suitable size, and then put it into the existing single cutting machine, making it difficult to increase the output

[0013] In addition, if the layout of 370㎜×470㎜ or larger is to be directly cut to order, an additional special machine is required, resulting in an increase in product production costs.

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