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Circuit carrier, method for producing circuit carrier, and method for producing and operating circuit arrangement

A circuit carrier and insulating carrier technology, applied in the field of manufacturing semiconductor modules, can solve problems such as partial discharge and breakdown

Active Publication Date: 2016-05-11
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Undesirable voltage breakdowns or partial discharges can thus occur

Method used

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  • Circuit carrier, method for producing circuit carrier, and method for producing and operating circuit arrangement
  • Circuit carrier, method for producing circuit carrier, and method for producing and operating circuit arrangement
  • Circuit carrier, method for producing circuit carrier, and method for producing and operating circuit arrangement

Examples

Experimental program
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Effect test

Embodiment Construction

[0031] figure 1 shows a cross-section of the circuit carrier 2, and figure 2 A top view is shown. according to figure 1 The cross-sectional plane E1-E1 of the diagram in figure 2 shown in . The circuit carrier 2 has a dielectric insulating carrier 20 with an upper side 20t, on the upper side there is an upper metallization layer 21 and an optional lower metallization layer 22, the coating of which is on the dielectric insulating carrier 20. On the lower side 20b facing away from the upper side 20t. If upper and lower metallization layers 21 , 22 are present, they can therefore be located on mutually opposite sides of the insulating carrier 20 . The upper metallization layer 21 can optionally be formed so that it has printed circuits, which can be used, for example, for electrical switching or for chip mounting. A dielectric insulating carrier 20 can be used for this purpose to electrically insulate the upper metallization layer 21 and the lower metallization layer 22 f...

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PUM

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Abstract

The invention relates to a circuit carrier (2). The circuit carrier includes a dielectric isolation carrier (20), an upper metallization layer (21) applied to the dielectric isolation carrier (20), and a dielectric coating (3). The upper metallization layer (21) has a metallization section (25) which has an underside (25b) facing the isolation carrier (20), a top side (25t) facing away from the isolation carrier (20), and a side surface (25s) closed in a ring-shaped fashion. The side surface laterally delimits the metallization section (25) and extends continuously between the top side (25t) and the underside (25b). The dielectric coating (3) is on the side surface and the top side, and extends continuously from the side surface onto the top side.

Description

technical field [0001] The invention relates to a circuit carrier, a method for producing a circuit carrier, a method for producing a circuit arrangement, a method for operating a circuit arrangement and a method for producing a semiconductor module. Background technique [0002] Electrical circuit arrangements are often realized by means of circuit carriers, which are subjected to high voltages during their operation. Undesirable voltage breakdowns or partial discharges can thus occur. Contents of the invention [0003] It is an object of the present invention to provide a circuit carrier and a method for producing a circuit carrier which have a high strength against voltage breakdown and a high partial discharge strength. A further object is to provide a method for producing a circuit arrangement which has a high strength against voltage breakdown and a high partial discharge strength. A still further object is to provide a method for operating a circuit arrangement in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/492H01L21/56H01L21/58
CPCH01L21/561H01L23/4926H01L24/80H01L24/83H01L23/053H01L2924/181H01L2224/32225H01L2224/48091H01L2224/48472H01L2224/73265H01L2924/19107H01L23/15H01L23/3735H01L24/27H01L2224/83101H01L2224/83192H01L2224/92247H01L23/60H01L23/62H01L25/072G05F3/02H01L21/4857H01L23/49822B23K1/0016H01L2924/00014H01L2924/00012H01L21/54H01L25/065
Inventor C·埃勒斯T·洪格尔
Owner INFINEON TECH AG