Rigid-flex board and manufacturing method thereof

A soft-rigid combination board and sub-board technology, applied in printed circuit manufacturing, structural connection of printed circuits, printed circuit components, etc. Long service life, easy removal effect

Active Publication Date: 2016-05-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high hardness of the hard board, when punching, the multi-layered soft board and hard board may damage the punching die, which will affect the use of the punching die.

Method used

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  • Rigid-flex board and manufacturing method thereof
  • Rigid-flex board and manufacturing method thereof

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] For the convenience of description, spatial relative terms such as "under", "below", "below", "over", "upper" and other spatial relative terms can be used to describe the One element or feature shown in relationship to another element or feature(s). It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly on, or directly on the other elemen...

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PUM

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Abstract

The invention discloses a rigid-flex board and a manufacturing method thereof. The rigid-flex board comprises a flexible substrate layer, copper foil layers overlapped on the flexible substrate layer, covering films attached to the copper foil layers, rigid layers overlapped on the covering films and circuit layers overlapped on the rigid layers, wherein each circuit layer is provided with an open window passing through the flexible substrate layer to divide the circuit layer into two oppositely-arranged parts; part of the flexible substrate layer is exposed in the open window; and the flexible substrate layer is connected between two parts of the circuit layer. According to the rigid-flex board and the manufacturing method thereof provided by the embodiment of the invention, through arranging the open window passing through the flexible substrate layer in the circuit layer and using the part exposed in the open window of the flexible substrate layer to connect the two parts of the circuit layer, when board dividing needs to be carried out on the rigid-flex board, a punching die only needs to be adopted to cut off the part, exposed in the open window, of the flexible substrate layer to realize board dividing, the phenomenon that the punching die is likely to be damaged due to cutoff of multiple layers of rigid material can be avoided, and the service life of the punching die is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a rigid-flex board and a preparation method thereof. Background technique [0002] Rigid-flex boards are more and more widely used because they have the properties of both soft boards and rigid boards. [0003] At present, when making soft and hard boards, usually the soft board and the hard board are produced separately, and then the soft board and the hard board are pressed and connected. Due to this method, the connecting ribs between the soft and hard boards and the process side are connected by the direct extension of the hard board part. When the board is divided later, because the connecting ribs are covered with hard boards and soft boards, therefore, The sub-board mold needs to die-cut multi-layer hard boards and soft boards to form. Due to the high hardness of the hard board, during punching, the punching of the multi-layered soft board and hard board may damag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/147H05K3/361H05K2203/0221
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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