360-degree light source packaging device

A technology of light source sealing and fluorescent adhesive layer, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as leakage, impure color of white light, and limited light output angle

Inactive Publication Date: 2016-05-25
CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the fluorescent glue 3 is used to coat the glass substrate 1 on both sides, so as to solve the problem of limited light output angle, and can achieve 360° light emission. However, because the glass substrate is a transparent substrate, some blue light passes through the glass substrate. Leaking out will lead to the appearance of white light with impure color and partial bluish uneven spots, which will cause certain damage to human eyes.

Method used

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Embodiment Construction

[0038] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0039] Such as Figure 3 to Figure 6Shown is a 360-degree light source packaging device according to the first preferred embodiment of the present invention, so as to achieve 360-degree light emission and improve the utilization rate of the light source. The 360-degree light source packaging device includes a substrate 10, a first dam glue 20, a first fluorescent glue layer 30, one or more chips 40, a plurality of connection units 50, a second dam glue 6...

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Abstract

The invention provides a 360-degree light source packaging device, which comprises a substrate, first box dam rubber, a first fluorescent glue layer, one or more chips, one or more connecting units, second box dam rubber and a second fluorescent glue layer, wherein the first box dam rubber is located at the upper part of the substrate and surrounds the first fluorescent glue layer; the chips are located on the first fluorescent glue layer; the connecting units are connected to the chips and the substrate; the second box dam rubber is located at the upper part of the substrate and surrounds the second fluorescent glue layer; and the second fluorescent glue layer coats the chips, the first fluorescent glue layer, the connecting units and the first box dam rubber.

Description

technical field [0001] The invention relates to a light source packaging device, in particular to a 360-degree light source packaging device to achieve 360-degree light emission, avoid blue light leakage to protect eyes, improve the utilization rate of light sources and reduce manufacturing costs. Background technique [0002] At present, various light-emitting diode (LED) products can be seen everywhere in today's society, such as traffic signs, car head and tail lights, locomotive head and tail lights, street lights, computer indicator lights, flashlights, LED backlights, etc. These are products that are extended through the LED chip manufacturing process, among which there is a very important process in the LED chip manufacturing process - packaging. [0003] In the packaging structure of LEDs, taking the structure of lead frame packaging as an example, the general process is die bonding, wire bonding and molding. Among them, the molding is to fill the lead frame that ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52H01L33/54H01L25/075
CPCH01L25/0753H01L33/52H01L33/54H01L2224/48091H01L2224/48137H01L2224/49109H01L2924/00014
Inventor 方涛
Owner CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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