Product material thickness three-dimensional analysis system and method
A technology of analysis system and analysis method, which is applied in the field of detecting the material thickness of products, can solve the problems of three-dimensional measurement of shape and surface, etc., and achieve the effect of improving measurement efficiency and measurement accuracy
Inactive Publication Date: 2016-06-01
FU TAI HUA IND SHENZHEN +1
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Problems solved by technology
[0002] Product assembly, material optimization, etc. all need to measure the thickness of the product. The traditional measurement method is to use calipers or three-coordinate measuring equipment to measure the same position on the front and back of the product, which cannot achieve three-dimensional measurement of the entire shape. Measurement
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[0033] like figure 1 As shown, it is a schematic diagram of the operating environment of a preferred embodiment of the three-dimensional analysis system for product material thickness of the present invention. The three-dimensional analysis system 10 for product material thickness runs on a host computer 1 connected to a display device 2 and an input device 3 . The host 1 includes a storage device 12 and at least one processor 14 . The input device 3 can be a keyboard or a mouse. The host 1 may be, but not limited to, a personal computer, a server and other devices. The host 1 is also connected with a three-dimensional scanner 4 . The 3D scanner 4 includes one or more Charge Coupled Devices (CCD), such as binocular CCD, and a working platform. The workpiece to be tested is placed horizontally on the working platform shown. The three-dimensional scanner 4 scans the contour of the workpiece to be measured at different angles through the charge-coupled device to obtain a poi...
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A product material thickness three-dimensional analysis method is applied to a host. The host is connected with a three-dimensional scanner. The method comprises the steps of scanning a workpiece to be detected through a charge coupled device of the three-dimensional scanner, to obtain a point cloud of the workpiece to be detected; carrying out triangular meshing processing of the point cloud; calculating each front triangle and a corresponding reverse triangle in the point cloud after the triangular meshing; calculating a material thickness deviation array of the workpiece to be detected according to each front triangle and the corresponding reverse triangle; calculating material thickness information of the workpiece to be detected according to the material thickness deviation array of the workpiece to be detected; and generating a detection report according to the material thickness information and a color tolerance zone of the workpiece to be detected. The invention further provides a product material thickness three-dimensional analysis system. The invention can be used for three-dimensional measurement of the whole shape and surface of the product and can improve the measurement efficiency and accuracy.
Description
technical field [0001] The invention relates to a detection technology, in particular to a system and method for detecting material thickness of a product. Background technique [0002] Product assembly, material optimization, etc. all need to measure the thickness of the product. The traditional measurement method is to use calipers or three-coordinate measuring equipment to measure the same position on the front and back of the product, which cannot achieve three-dimensional measurement of the entire shape. Measurement. Contents of the invention [0003] In view of the above, it is necessary to provide a three-dimensional analysis system for product material thickness, which can perform three-dimensional measurement of the entire shape and surface of the product, and improve the measurement efficiency and measurement accuracy. [0004] It is also necessary to provide a three-dimensional analysis method for product material thickness, which can perform three-dimensional ...
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IPC IPC(8): G01B11/06G06T7/00
CPCG01B11/06
Inventor 张旨光吴新元
Owner FU TAI HUA IND SHENZHEN