A magnetron and semiconductor processing equipment

Abstract

The present invention provides a magnetron and magnetron sputtering equipment, comprising a plurality of magnets and a first back plate, the first back plate is used to fix a plurality of magnets in a preset arrangement on it, each of the magnets It is directly fixed on the first backplane in a detachable connection manner. In the magnetron provided by the present invention, the magnetic column can be directly assembled on the first baffle plate, which is not only convenient for assembly, but also can reduce the assembly time; in addition, the magnetic column in the magnetron will not fall off, and can Repeated use can avoid the waste of magnets, thereby improving economic benefits.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a magnetron and semiconductor body processing equipment. Background technique [0002] Magnetron sputtering equipment is a device that deposits the material sputtered from the target material on the workpiece to be processed to form a thin film by colliding particles in the plasma with the target material. In practical applications, in order to improve the efficiency of sputtering and the utilization of the target, a magnetron is installed on the back of the target, and the magnetic field generated by the magnetron is used to increase the movement time of electrons, so as to increase the electron and process gas ( Such as the probability of argon) collision, thereby increasing the density of the plasma, thereby improving the efficiency of sputtering and the utilization of the target. [0003] figure 1 It is a schematic structural diagram of the re...

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Problems solved by technology

[0005] First, since the magnetron 13 needs to be soaked in deionized cooling water, and superglue is used to fix between the fixed plate 133 and the magnetic column 131, the adhesion of the superglue is uneven and the superglue is soaked in deionized cooling water. The cohesive force of the super glue is reduced. Therefore, when the magnetic field of the magnetic pillars 131 is strong, the mutual adsorption between the magnetic pillars 131 is relatively large, and the magnetic pillars 131 will easily fall off.

For this reason, the fixed plate 133 needs to be disassembled, and the magnetic column 131 is first bonded on the fixed plate 133, and then the fixed plate 133 is fixed on the back plate 132, and since the magnetic column 131 is bonded with superglue, the Repeating the use of superglue once more will make the superglue bond more uneven and cause the magnetic column 131 to fall off more easily. Therefore, after the magnetic column 131 falls off and is reused for a certain number of times, it will be discarded and cannot be reused, thereby wasting the magnetic column 131;

[0006] Second, due to the bonding effect of the super glue, it needs to be used after 24 hours of applying the super glue, so it takes a long time to assemble the magnetron

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