Integrated illuminating and irradiating structure

A technology of a body and a reflective layer, applied in the field of integrated integrated lighting and illumination structure, can solve the problems of unfavorable heat dissipation of LED chips, low heat dissipation efficiency of LED chips, etc.

Inactive Publication Date: 2016-06-01
东莞市鸿展机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the entire heat dissipation process has to pass through multiple conductions, and the heat conduction coefficient of each heat conduction element is different, which is not cond

Method used

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  • Integrated illuminating and irradiating structure
  • Integrated illuminating and irradiating structure
  • Integrated illuminating and irradiating structure

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Embodiment Construction

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, many different structures and electrical forms can be derived on the basis of the present invention, and are not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions...

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Abstract

An integrated illuminating and irradiating structure comprises a radiating member, a PCB, LED chips and an adhesive layer, the radiating member comprises a body, and a reflection layer is arranged on the surface of the body. The LED chips are arranged on the reflection layer, and the PCB is equipped with a plurality of hollow parts and is arranged on the reflection layer of the radiating member. The adhesive layer is arranged between the PCB and the reflection layer, and the LED chips are accommodated in the hollow parts correspondingly and are electrically connected with the PCB. In the above integrated illuminating and irradiating structure, the LED chips are connected with the radiating member directly, so that the heat can be radiated out from the radiating member directly. Moreover, the reflection layer is arranged on the surface of the radiating member, when the LED chips emit light, on one hand, the reflection layer can reflect out the light rays which are irradiated on the reflection layer, so that the light rays are prevented from irradiating on the surface of the radiating member to generate a lot of heat and influence a heat radiation effect; on the other hand, the reflection layer enables the illumination effect of the integrated illuminating and irradiating structure to be improved.

Description

Technical field [0001] The invention relates to a lighting device, in particular to an integrated lighting and irradiation structure. Background technique [0002] The heat dissipation level of the LED chip is directly related to the light attenuation or the length of the life of the LED chip. At present, in the fields of high-power lighting and special high-power industrial illumination, the heat dissipation of LED chips is often first transferred from the LED chip to the carrier of the sealed lamp beads, and then to the printed circuit board (PrintedCircuitBoard) carrier, and then by The PCB board is transferred to the heat sink, and the heat is dissipated by the heat sink. Therefore, the entire heat dissipation process needs to be conducted multiple times, and the thermal conductivity of the thermally conducted components is different each time, which is not conducive to the heat dissipation of the LED chip in high-power lighting and special high-power industrial illumination...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/64
Inventor 王子敬刘春耕刘长春
Owner 东莞市鸿展机电设备有限公司
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