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Radiating fin group

A technology of heat dissipation fin sets and heat dissipation fins, which is applied in heat exchange equipment, indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of difficulty in quickly removing heat from heat dissipation fin plates and affecting the heat dissipation efficiency of heat dissipation modules.

Inactive Publication Date: 2016-06-01
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when the airflow velocity is lower, it is difficult for the airflow to quickly remove the heat from the heat dissipation fin plate, thereby affecting the overall heat dissipation efficiency of the heat dissipation module

Method used

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  • Radiating fin group
  • Radiating fin group
  • Radiating fin group

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Embodiment Construction

[0043] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient for any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content, claims and drawings disclosed in this specification, The related objects and advantages of the present invention can be easily understood by anyone skilled in the relevant art. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.

[0044] The present invention discloses a cooling fin set, which is suitable for an electronic device, such as a desktop computer, server, notebook computer, all-in-one computer, smart phone, etc., but the examples of the above-mentioned electronic devices are not intended to limit the present invention . In the present invention, the ...

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Abstract

A radiating fin group is disclosed. The radiating fin group comprises a first fin and a second fin; the second fin is arranged in parallel and adjacent to the first fin, wherein a projection surface is defined; the projection surface is parallel with the first fin and the second fin; and the projection sections formed by projecting the first fin and the second fin to the projection surface separately are different from each other. Therefore, when air flow passes through the radiating fin group, the boundary layer development can be destroyed, so that the problem of flow velocity decreasing caused by the boundary layer is reduced, and the radiating efficiency is further improved consequently.

Description

technical field [0001] The present invention relates to a cooling fin group, in particular to a cooling fin group with multiple cooling fin groups. Background technique [0002] In recent years, with the advancement of science and technology, the calculation speed of electronic devices is getting faster and faster, while their volume and weight are also increasingly reduced, so that the electronic devices are developing towards thinner, lighter and smaller designs. [0003] When the calculation speed of the electronic device is faster, the accompanying heat is also increased. Therefore, the electronic device needs to add a heat dissipation module with better heat dissipation capability to dissipate heat from the heat generating components of the electronic device. For example, the cooling module can be a fan, a cooling fin set, a heat pipe or a combination thereof. Wherein, the fan can drive an air flow to dissipate heat from the heat-generating components in a convection ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCF28D15/0275F28F1/30H01L23/3672H01L23/427H01L21/4882F28D15/0233
Inventor 郑懿伦杨智凯
Owner INVENTEC PUDONG TECH CORPOARTION