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Novel three-dimensional helical condensation structure nano-pulsation thermal superconducting device

A thermal superconducting, three-dimensional technology, applied to indirect heat exchangers, lighting and heating equipment, etc., can solve problems such as low recycling rate, instability and discontinuity, and poor pressure bearing capacity, so as to increase utilization rate and improve energy consumption. Utilization of efficiency and quality, and performance-enhancing effects

Active Publication Date: 2017-09-01
BAOTOU BOTE TECH
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0008] This patent is aimed at the problems of low temperature, poor pressure bearing capacity, low recycling rate, instability and discontinuity, difficult storage and other problems in the heat collection system in the solar thermal power generation technology that is currently being developed by the country, as well as aerospace, military, micro For the large-scale heat dissipation and cooling technology problems that are urgently needed in the manufacture of high-end equipment such as the electronics industry, develop and design a new three-dimensional condensing pulsating thermal superconducting device in order to improve energy utilization, achieve the purpose of efficient energy use, and realize energy saving and emission reduction and new energy utilization

Method used

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  • Novel three-dimensional helical condensation structure nano-pulsation thermal superconducting device
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  • Novel three-dimensional helical condensation structure nano-pulsation thermal superconducting device

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Embodiment 1

[0047] See Figure 1-2 , a closed new three-dimensional spiral condensation structure nano-pulsation thermal superconducting device, consisting of a cooling tube core 1, a condensation tube 2, five U-shaped evaporation tubes 3, a working medium in the tube 4, a liquid filling tube 5, and a thin plate heated by the evaporation tube 6, welding The metal film 7, the two ends of the cooling tube core 1 are provided with connecting ends, and corrugated expansion joints are respectively provided near the two connecting ends, and six sets of condenser tubes 2 are spirally wound on the outer surface of the cooling tube core 1 to form six sets of three-dimensional spirals Condenser tube, the first port of the first group of three-dimensional spiral condenser tubes is connected to the first port of the closed loop, the tail port of the first group of three-dimensional spiral condenser tubes is connected to the first port of the first U-shaped evaporation tube 3, and the first U-shaped ev...

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Abstract

The invention relates to a thermal superconducting device, in particular to a novel three-dimensional helical condensation structure nano-pulse thermal superconducting device. Condensation pipes are spirally wound on the outer surface of the cooling tube core of the present invention to form at least one three-dimensional condensation section. The serpentine pipe network is filled with working fluid. In the present invention, a condensing tube is spirally wound on the cooling tube core, and the heat transmitted from the evaporation section of the serpentine evaporating tube is removed by passing the cooling circulating fluid into the cooling tube core, thereby achieving adjustable heat transfer efficiency and increasing the utilization of input heat The rate can increase the heat transfer area and play a role in increasing the heat transfer efficiency.

Description

technical field [0001] The invention relates to a three-dimensional spiral condensation structure (nano) pulsating thermal superconducting device, which can be widely used in medium and high temperature solar heat collection, heat dissipation of multi-chip electronic components, heat dissipation of large flat radar chips, cooling or constant temperature heating of high-power power batteries, and LED display Screen, electromagnetic device cooling field. [0002] technical background [0003] Modern advanced microelectronic devices are composed of a large number of chips and electronic components. The heat of components mainly comes from their own resistive loads, such as transformers, integrated circuits, high-power transistors, high-power resistors, etc. The heat generated by them is large Part of it is emitted to the surrounding medium in the form of heat conduction, convection and radiation, and only a small part is emitted in the form of electromagnetic waves. With the im...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04
CPCF28D15/04
Inventor 王亚雄丁祥云
Owner BAOTOU BOTE TECH
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