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Activation solution for electroless plating on dielectric layers

A solution, electroless deposition technology, applied in liquid chemical plating, coating, circuit, etc., can solve the problems of long manufacturing operation, impractical and complicated manufacturing operation

Active Publication Date: 2016-06-15
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some known processes are complex and impractical for manufacturing operations
Another problem with some known processes is that they are slow and the process practice is too long for practical manufacturing operations

Method used

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  • Activation solution for electroless plating on dielectric layers

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Embodiment Construction

[0013] The present invention relates to electronic devices, and more particularly, to the metallization of electronic devices. The present invention entails overcoming one or more problems in the manufacture of electronic devices, such as the manufacture of semiconductor devices using integrated circuits.

[0014] Embodiments of the invention and their operation are discussed below, primarily in the context of the processing of semiconductor wafers, such as silicon wafers, used in the manufacture of integrated circuits. The following discussion is primarily directed to silicon electronic devices using metallization layers having metal layers formed thereon or in oxidized dielectric structures. However, it should be understood that embodiments in accordance with the present invention may be used with other semiconductor devices, with various metal layers, and with semiconductor wafers other than silicon.

[0015] One aspect of the invention is a solution for activating an oxid...

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Abstract

Presented is a solution to activate an oxide surface for electroless deposition of a metal. The solution comprises a binding agent having at least one functional group capable of forming a chemical bond with the oxide surface and at least one functional group capable of forming a chemical bond with a catalyst. Also present are methods of fabricating electronic devices and electronic devices fabricated using the method.

Description

[0001] This application is a divisional application of the invention patent application with the application number 200880127388.4, the application date is December 20, 2008, and the invention title is "activation solution for electroless plating on dielectric layer". technical field [0002] This application claims the benefit of United States Patent Application Serial No. 61 / 016,439, Docket No. XCR-010, entitled "ACTIVATIONSOLUTIONFORELECTROLESSPLATINGONDIELECTRICLAYERS," ArturKOLICS et al., filed December 21, 2007. US Patent Application Serial No. 61 / 016,439, filed December 21, 2007, is hereby incorporated by reference in its entirety. Background technique [0003] This invention relates to the fabrication of electronic devices such as integrated circuits, and more particularly, the present invention relates to methods and solutions for the activation of dielectric oxide surfaces for electroless plating of electronic devices. [0004] Electroless deposition is a process f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/31H01L21/70
CPCC23C18/1879C23C18/1882C23C18/1889C23C18/31H01L21/70B01J31/1633B01J31/1805B01J2231/60B01J2231/62B01J2531/824H01L21/288H01L21/76874
Inventor 阿尔图尔·科利奇
Owner LAM RES CORP