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L-shaped FPC jointed board structure

An L-shaped, jigsaw technology, applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve the problem of low utilization of jigsaw panels and achieve the effect of improving utilization

Active Publication Date: 2016-06-15
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide an L-shaped FPC panel structure to solve the problem of low panel utilization due to the FPC panel structure in the prior art

Method used

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  • L-shaped FPC jointed board structure
  • L-shaped FPC jointed board structure
  • L-shaped FPC jointed board structure

Examples

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Embodiment 1

[0025] The FPC soft board in this embodiment can be replaced with a PCB hard board, or can be a combined board of an FPC soft board and a PCB hard board.

[0026] Please refer to figure 1 , figure 2 with image 3 , figure 1 It is a schematic diagram of the overall structure of an L-shaped FPC panel structure 30 according to an embodiment of the present invention, figure 2 It is a schematic structural diagram of a Z-shaped FPC combination board 20 of an L-shaped FPC panel structure 30 according to an embodiment of the present invention. image 3 It is a schematic structural diagram of an L-shaped FPC veneer 10 of an L-shaped FPC panel structure 30 according to an embodiment of the present invention, from Figure 1 to Figure 3 can be seen:

[0027] A kind of L-shaped FPC puzzle structure 30 of the present embodiment comprises a puzzle panel 40 and a plurality of identical Z-shaped FPC composite panels 20 arranged at intervals on the panel 40, each of which The upper and ...

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Abstract

The invention discloses an L-shaped FPC jointed board structure. The L-shaped FPC jointed board structure comprises a jointed board material and multiple same Z-shaped FPC combined boards that are spaced and combined mutually and are arranged on the jointed board material; the upper transverse border and the lower transverse border of each Z-shaped FPC combined board are both perpendicular to the vertical borders thereof respectively; between adjacent two Z-shaped FPC combined boards, the upper edge of the upper transverse border, the right edge of the vertical border and the upper edge of the lower transverse border of one Z-shaped FPC combined board are arranged relatively parallel to the lower edge of the upper transverse border, the left edge of the vertical border and the lower edge of the lower transverse border of the other Z-shaped FPC combined board respectively, and gaps are formed between the two Z-shaped FPC combined boards; the gaps between the upper transverse borders of the adjacent two Z-shaped FPC combined boards, and the gaps between the lower transverse borders of the adjacent two Z-shaped FPC combined boards are first gaps; and the gaps between the vertical borders of the two Z-shaped FPC combined boards are second gaps. By adoption of the L-shaped FPC jointed board structure, the utilization ratio of the jointed board material is greatly improved.

Description

technical field [0001] The invention relates to the field of panel structure, in particular to an L-shaped FPC panel structure. Background technique [0002] Flexible circuit boards, also known as "soft boards", are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The flexible circuit board can greatly reduce the volume and weight of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K1/147H05K2201/058
Inventor 陈鑫锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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