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Cutting device and cutting method

A cutting device and cutting line technology, applied in metal processing and other directions, can solve the problem of inability to reduce the operating cost of the cutting device, and achieve the effect of reducing the operating cost and reducing the amount of use

Active Publication Date: 2017-10-13
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, excessive supply of cooling water is wasteful, so the operating cost of the cutting device cannot be reduced

Method used

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  • Cutting device and cutting method
  • Cutting device and cutting method
  • Cutting device and cutting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] For Embodiment 1 of the cutting device involved in the present invention, refer to Figure 1 ~ Figure 3 to explain. Any of the drawings in this application document are schematically drawn with appropriate omission or exaggeration for easy understanding. The same reference numerals are attached to the same structural elements, and explanations thereof are appropriately omitted.

[0087] Such as figure 1 As shown, a spindle 1 as a cutting mechanism includes: a spindle main body 2 ; a spindle motor 3 as a drive mechanism; and a rotating shaft 4 connected to the spindle motor 3 . The rotary shaft 4 is rotatably supported by the spindle main body 2 in a non-contact state by air jetted from the radial air bearing 5 and the axial air bearing 6 . In order to suppress thermal expansion due to heat generated by the rotating shaft 4 rotating at a high speed, a cooling water passage 7 for flowing cooling water around the rotating shaft 4 is provided. The cooling water passage...

Embodiment 2

[0109] For embodiment 2 of the cutting device involved in the present invention, refer to Figure 4 to explain. Such as Figure 4 As shown, the cutting device 20 is a device for singulating a cut object into a plurality of products. The cutting device 20 includes a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements. Each constituent element (each unit A to C) is detachable and replaceable with respect to each other constituent element.

[0110] In the substrate supply unit A, a substrate supply mechanism 21 is provided. The package substrate 22 corresponding to the cut object is carried out from the substrate supply mechanism 21 and transferred to the substrate cutting unit B by a transfer mechanism (not shown). The substrate supply unit A is provided with a control mechanism 19 that controls the operations of the cutting device 20 and the spindle 1 , the flow rate of cooling water, and the like.

[0111] Figure 4 The sho...

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PUM

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Abstract

The invention provides a cutting device and a cutting method. In the shutoff device, the flow rate of the supplied cooling water is adjusted according to the shutoff load. In the cutting device, a spindle motor, a rotating shaft, a rotating blade, and a cooling water passage are provided in the spindle. A displacement sensor is provided at a position opposite to the flange. A current measuring unit for measuring a drive current is connected to the spindle motor, and a flow rate adjusting unit for adjusting the flow rate of the cooling water is connected to the cooling water passage. The measured value of the current value measured by the current measuring means is compared with the stored value of the previously stored current value. When the measured value is greater than the stored value, the initial flow rate of cooling water is supplied to the spindle. When the measured value is lower than the stored value, the flow rate is reduced to supply cooling water. Therefore, the flow rate of the supplied cooling water can be adjusted according to the magnitude of the load current of the spindle motor. Since an appropriate flow rate of cooling water is supplied to the spindle, the amount of cooling water used can be reduced.

Description

technical field [0001] The present invention relates to a cutting device and a cutting method for manufacturing a plurality of singulated products by cutting a cut object. Background technique [0002] Virtually divide a substrate composed of a printed circuit board or a lead frame into a plurality of grid-like areas, mount chip-shaped components (such as semiconductor chips) in each area, and then resin-encapsulate the entire substrate to obtain the product Called the packaging substrate. The package substrate is cut by a cutting mechanism using a rotary blade or the like, and is separated into individual pieces to form a product. [0003] Conventionally, a cutting mechanism is used in a cutting device to cut a predetermined region of a package substrate with a cutting unit such as a rotary blade. First, the package substrate is placed and adsorbed on the table for cutting. Next, alignment (alignment) is performed on the package substrate. By performing the alignment, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26D7/00B26D7/26
Inventor 片冈昌一东秀和
Owner TOWA