Cutting device and cutting method
A cutting device and cutting line technology, applied in metal processing and other directions, can solve the problem of inability to reduce the operating cost of the cutting device, and achieve the effect of reducing the operating cost and reducing the amount of use
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Embodiment 1
[0086] For Embodiment 1 of the cutting device involved in the present invention, refer to Figure 1 ~ Figure 3 to explain. Any of the drawings in this application document are schematically drawn with appropriate omission or exaggeration for easy understanding. The same reference numerals are attached to the same structural elements, and explanations thereof are appropriately omitted.
[0087] Such as figure 1 As shown, a spindle 1 as a cutting mechanism includes: a spindle main body 2 ; a spindle motor 3 as a drive mechanism; and a rotating shaft 4 connected to the spindle motor 3 . The rotary shaft 4 is rotatably supported by the spindle main body 2 in a non-contact state by air jetted from the radial air bearing 5 and the axial air bearing 6 . In order to suppress thermal expansion due to heat generated by the rotating shaft 4 rotating at a high speed, a cooling water passage 7 for flowing cooling water around the rotating shaft 4 is provided. The cooling water passage...
Embodiment 2
[0109] For embodiment 2 of the cutting device involved in the present invention, refer to Figure 4 to explain. Such as Figure 4 As shown, the cutting device 20 is a device for singulating a cut object into a plurality of products. The cutting device 20 includes a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements. Each constituent element (each unit A to C) is detachable and replaceable with respect to each other constituent element.
[0110] In the substrate supply unit A, a substrate supply mechanism 21 is provided. The package substrate 22 corresponding to the cut object is carried out from the substrate supply mechanism 21 and transferred to the substrate cutting unit B by a transfer mechanism (not shown). The substrate supply unit A is provided with a control mechanism 19 that controls the operations of the cutting device 20 and the spindle 1 , the flow rate of cooling water, and the like.
[0111] Figure 4 The sho...
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