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Method for surface treatment of semiconductor substrates

A semiconductor and substrate technology, used in semiconductor/solid-state device manufacturing, printing, electrical components, etc., and can solve problems such as instability

Active Publication Date: 2017-12-08
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of coating is known to be unstable when exposed to a liquid environment, such as in the case of many water-based inks

Method used

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  • Method for surface treatment of semiconductor substrates
  • Method for surface treatment of semiconductor substrates
  • Method for surface treatment of semiconductor substrates

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0050] Example 1 - Preparation of an anti-wetting coating on a semiconductor material substrate:

[0051] The first step of the process involves fabricating the PDMS support.

[0052] Specifically, a pre-polymerized mixture is prepared, from the matrix 184 SILICONE ELASTOMER KIT (registered in the name of Dow Corning Corporation, Michigan, USA) and a cross-linking agent (Dow Corning) are composed at a weight percentage of 10:1. Degassing of the mixture was then performed under vacuum for one hour. The mixture thus obtained was deposited on a silicon masterbatch measuring 3 cm x 3 cm. The masterbatch was pre-coated with an organosilane layer for subsequent desorption to the PDMS support. The mixture deposited on the masterbatch was then crosslinked in an oven at 90° C. for one hour, and the PDMS support thus obtained was desorbed from the silicon masterbatch.

[0053] The PDMS support thus obtained was immersed in the 1-hexadecene chain solution for 12 hours under nitrogen...

example 2

[0059] Example 2 - Properties of the anti-wetting substrate according to Example 1

[0060] Nozzle panels for inkjet printing provided according to the method described in Example 1 were tested for their anti-wetting capabilities.

[0061] Each of four identical panels (Sample 1-Sample 4) having dimensions 40 mm x 12 mm was introduced into a vial containing a cyan pigment with a pH between 7 and 9 and a water-based ink.

[0062] Dip two-thirds of the surface of each panel into the ink. The vial was then closed to prevent ink evaporation and set at a temperature of 60°C for 7 days.

[0063] Next, the panel was removed from the vial and cleaned with demineralized water followed by 2-propanol. The panels are then dried.

[0064] The wetting resistance of the panels thus obtained was evaluated by measuring the contact angle of water droplets deposited thereon. In particular, the contact angle values ​​on the panel before applying the anti-wetting layer according to the describ...

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PUM

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Abstract

The present disclosure relates to methods for surface treatment of semiconductor substrates. In particular, a method for applying an anti-wetting coating to a substrate of semiconductor material is described. Said method comprises applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and optionally at least one heteroatom for obtaining a hydrocarbon layer on said support. The method also includes treating at least one surface of the substrate of semiconductor material with an acid. The hydrocarbon layer is transferred from the support to the surface of the semiconductor material substrate. The hydrocarbon layer is chemically coupled to the surface of the semiconductor material substrate. The method can be applied to an integrated inkjet printhead with a nozzle panel serving as a semiconductor material substrate.

Description

[0001] Prior Applications and Cross-References [0002] This application claims priority to Italian Patent Application No. TO2014A001089 filed December 22, 2014, the content of which is incorporated by reference in its entirety into this application to the fullest extent permitted by law. technical field [0003] The present invention relates to a method for the surface treatment of semiconductor material substrates, in particular nozzle panels for inkjet printers, and more particularly, to a method for applying a chemically stable and confined to the nozzle surface. Method of wet coating. Background technique [0004] In various applications, it is necessary to apply water- and / or oil-repellent coatings to surfaces exposed to liquids. For example, in the case of inkjet printheads, it is necessary to apply an anti-wetting coating (AWC) on the printhead nozzle faceplate to prevent ink from forming residues during or after inkjet printing. In fact, residual buildup around t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/16B41J2/14
CPCB41J2/1433B41J2/1629B41J2/1606B41J2/164B41J2/162H01L21/02115H01L21/30604H01L21/0206H01L21/02288
Inventor V·迪帕尔玛F·波罗
Owner STMICROELECTRONICS SRL