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Flexible substrate of bendable display device and manufacturing method for flexible substrate

一种显示器件、柔性基板的技术，应用在半导体/固态器件制造、电固体器件、半导体器件等方向，能够解决良品率低、电子元件线路错位、变形等问题，达到延长弯折寿命、避免线路错位、分散弯曲应力的效果

Active Publication Date: 2016-06-29
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for bendable display devices, the existing flexible substrates will be slightly deformed when bent, resulting in adverse effects such as dislocation of electronic components and low yield, which will increase the cost of flexible display devices
In addition, the existing flexible substrate will also generate bending stress when bending, which affects the bending life of the display device

Method used

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  • Flexible substrate of bendable display device and manufacturing method for flexible substrate
  • Flexible substrate of bendable display device and manufacturing method for flexible substrate
  • Flexible substrate of bendable display device and manufacturing method for flexible substrate

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Embodiment Construction

[0027] In order for those skilled in the art to better understand the technical solution of the present invention, the flexible substrate of the bendable display device provided by the present invention and the manufacturing method thereof will be described in detail below with reference to the accompanying drawings.

[0028] figure 1 It is a schematic diagram of fiber distribution of the fiber reinforced layer of the flexible substrate of the bendable display device provided by the first embodiment of the present invention. see figure 1 , the flexible substrate includes a bendable base layer 1, the base layer 1 includes a bending area A, a non-bending area B and a boundary area C, the boundary area C is the junction of the self-bending area A and the non-bending area B The area where the line extends toward the non-bending area B. The portion of the base layer 1 corresponding to the bending area A is bendable, while the portion corresponding to the non-bending area B is not...

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Abstract

The invention provides a flexible substrate of a bendable display device and a manufacturing method for the flexible substrate. The flexible substrate comprises a bendable base layer, wherein the base layer comprises a bending region and a non-bending region; the flexible substrate also comprises a fiber enhancement layer; and the fiber enhancement layer is arranged on the surface of the base layer, and distributed in the bending region and / or the non-bending region specific to different bending conditions of the base layer. By adoption of the flexible substrate of the bendable display device provided by the invention, the semiconductor device on the flexible substrate can be protected; the conditions of electronic element line dislocation, low yield and the like can be avoided; and the bending stress generated in bending the flexible substrate can be dispersed, so that the bending service life of the display device can be prolonged.

Description

technical field [0001] The present invention relates to the technical field of display devices, in particular to a flexible substrate of a bendable display device and a manufacturing method thereof. Background technique [0002] Currently, bendable displays can be realized through liquid crystal display (LCD) and organic light emitting diode (OLED) display panels. Among them, benefiting from the characteristics of self-illumination, OLED displays prepared on flexible substrates are easier to achieve bendable displays with smaller bending radii. Therefore, the fabrication of OLED display panels including flexible substrates has attracted extensive attention. [0003] However, for a bendable display device, the existing flexible substrate will be slightly deformed when it is bent, resulting in adverse effects such as dislocation of electronic components and low yield rate, thereby increasing the cost of the flexible display device. In addition, when the existing flexible sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/762
Inventor 王涛
Owner BOE TECH GRP CO LTD