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Method for manufacturing casing of electronic device and casing formed using same

A manufacturing method and technology of an electronic device, which are applied in the fields of electrical digital data processing, instruments, computing, etc., can solve the problems of excessive cutting time and decreased manufacturing process efficiency.

Active Publication Date: 2019-09-27
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, mechanical cutting requires a lot of cutting time for the curved shell profile, resulting in a decrease in the efficiency of the manufacturing process

Method used

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  • Method for manufacturing casing of electronic device and casing formed using same
  • Method for manufacturing casing of electronic device and casing formed using same
  • Method for manufacturing casing of electronic device and casing formed using same

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Embodiment Construction

[0027] Please refer to Figure 1A to Figure 5B , which shows a manufacturing process diagram of the casing of the electronic device according to an embodiment of the present invention.

[0028] Such as Figure 1A to Figure 1D as shown, Figure 1A An appearance diagram of a plate according to an embodiment of the present invention is shown, Figure 1B draw Figure 1A The cross-sectional view of the substrate along the direction 1B-1B', Figure 1C draw Figure 1B The metallographic diagram of the substrate surface, Figure 1D draw Figure 1B Metallographic diagram of the substrate cross-section. In this step, a board 100' is provided. The plate 100' is formed by, for example, a rolling process. During the rolling process, the plate 100' is subjected to rolling pressure which causes the die 101 to become brittle and cause misalignment, deformation and / or stacking. For example, if Figure 1C As shown in the metallographic diagram, the plate 100' has a metallographic struc...

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PUM

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Abstract

The invention discloses a method for manufacturing a casing of an electronic device and a casing formed using the same. The manufacturing method includes the following steps. First, a sheet material is provided, wherein the sheet material has a metallographic structure that breaks the brittle core. Then, the plate material is pressed to form a casing. The casing includes a side plate and a cover plate. The cover plate is a flat plate and has a first thickness, and the side plate has a second thickness. Then, the flat plate of the casing is machined so that the first thickness of the flat plate is smaller than the second thickness of the side plate.

Description

technical field [0001] The invention relates to a method for manufacturing a case of an electronic device and a case formed by using the same, and in particular to a method for manufacturing a case of an electronic device with a broken die and a case formed by using the same. Background technique [0002] The casings of traditional electronic devices are usually formed by fully mechanical cutting. However, mechanical cutting requires more cutting time for the curved casing profile, resulting in a decrease in the efficiency of the manufacturing process. [0003] Therefore, how to overcome the above-mentioned problems to reduce the manufacturing process time is one of the goals of the practitioners in this technical field. Contents of the invention [0004] The purpose of the present invention is a method for manufacturing a case of an electronic device and a case formed by using the same, which can reduce the manufacturing process time of the case and improve the efficienc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16
Inventor 许嘉元彭新鉴区宗源陈哲璋
Owner HTC CORP