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86results about How to "Improve manufacturing process efficiency" patented technology

Method for manufacturing an item

According to a first aspect of the present invention, a method is provided for manufacturing an item. The method comprises the steps of creating a build schedule; creating a first portion of the item for manufacture; causing the first portion of the item to pass in close proximity to a first individual; which said individual assembles at least one of the several components on the first portion; notifying a second individual of the existence and location of the first portion of the item proximate to the first individual; causing the first portion of the item to pass in close proximity to the second individual whereby said second individual assembles at least one of the several components onto the first portion of the item. The method further includes applying dataforms or other such markings on individual components to uniquely identify them and, through such markings, tracking the application of those components to the item being manufactured at each manufacture step. Moreover, the information associated with the components as they are tracked through the manufacture process is used to maintain and enhance the efficient operation of the assembly line. These and other aspects, features, and advantages of the present invention will become apparent from a reading of the following detailed description of the preferred embodiment of the invention and by reference to the following drawings.
Owner:AGENTWARE SYST

Welding-free storage battery and production method thereof

The invention relates to the technical field of chemical power supply materials and in particular relates to a welding-free storage battery and a production method thereof. A continuous type welding-free lead storage battery pole group comprises continuous type positive electrode plates, continuous type negative electrode plates, a single-body-spanning connection sheet, a continuous type bipolar pole plate and a separation plate, wherein the continuous type bipolar pole plate is composed of the continuous type positive electrode plates, the continuous type negative electrode plates and the separation plate, which are inserted and matched. According to the welding-free storage battery provided by the invention, an integrated continuous design is carried out on the lead storage battery polegroup and a welding procedure of a plurality of pieces of the positive electrode plates or negative electrode plates in a pole plate group during a storage battery production process is eliminated; aserial and parallel connection welding procedure of bridge-spanning welding, wall-penetrating welding and the like of a plurality of single bodies of the storage battery is also eliminated. Therefore,the use amount of lead of the storage battery is reduced and sheet falling and missing welding phenomena do not happen between the pole plate group of the storage battery and the single bodies; the product quality and reliability of the storage battery are effectively improved.
Owner:JIANGSU HUAFU STORAGE NEW TECH DEV

A continuous solder-free lead-acid battery electrode group and a manufacturing method thereof

The invention relates to the technical field of chemical power supply materials, in particular to a continuous solderless lead-acid battery electrode group and a manufacturing method thereof. The continuous solder-free lead-acid battery electrode group comprises a continuous positive electrode plate, a continuous negative electrode plate, a cross-unit connecting piece, a continuous bipolar electrode plate and a separator, wherein the continuous bipolar electrode plate is composed of a continuous positive electrode plate, a continuous negative electrode plate and a separator which are insertedand matched. A lead storage battery electrode group is integrally and continuously design, and that welding procedure of a plurality of positive plate or negative plates in the electrode plate group in the production process of the storage battery is eliminated, and the series and parallel welding procedures such as cross-bridge welding and through-wall welding between a plurality of monomers of the storage battery are also eliminated. This not only reduces the lead consumption of the battery, but also does not appear the phenomenon of chips falling off and missing welding between the electrode plate group and the monomer of the battery, which effectively improves the product quality and reliability of the battery. In addition, the electrode group of the invention has high manufacturing process efficiency and is convenient for production and processing.
Owner:JIANGSU HUAFU STORAGE NEW TECH DEV

High-performance anti-deformation 3D printing material and preparation method thereof

InactiveCN111792873AHigh structural strength Anti-deformationGood flexibilityAdditive manufacturing apparatusRotary stirring mixersEmulsionOragene
The invention discloses a high-performance anti-deformation 3D printing material, which comprises the following raw materials in parts by weight: 1 part of acrylic emulsion and 20-200 parts of inorganic compound powder. The preparation method comprises following steps: mixing and stirring acrylic emulsion and inorganic compound powder by a mixing device; introducing uniformly mixed raw materials into a drying device; firstly, making the raw materials fall into a rotary drum through a first material guide pipe; introducing the centrifugally dried raw materials into a conveying device; making centrifugally dried raw materials fall onto a conveying belt conveying the raw materials through the conveying belt, heating the raw materials on the conveying belt during the conveying of the raw materials, introducing residual mother liquor into a condenser from a condenser connecting pipe, making the raw materials conveyed to the top of a conveying box fall into a crushing device; and grinding the raw materials by two sets of grinding rollers driven by a gear and a transmission shaft so as to obtain the 3D printing material. The 3D printing material has high structural strength and deformation resistance of the inorganic compound and high flexibility of an organic polymer, and the preparation process is high in efficiency.
Owner:韶关市飞胜新材料有限公司 +1

Manufacturing method of LCP material high-frequency plate

The invention discloses a manufacturing method of an LCP material high-frequency plate. The manufacturing method of the LCP material high-frequency plate comprises the following steps that a base plate is adsorbed and fixed through a sucker, then an air cylinder is controlled to contract and is located on the top face of a fixing box, and then a driving motor is controlled to work clockwise intermittently, so that each set of installed base plates sequentially pass through a spraying plate connected with a first raw material barrel, and a liquid film is sprayed to the surface of the base plate; after the base plate is completely coated, the coated substrate is moved to the position above an opening of a drying oven through a conveying belt, and a thin film layer is formed on the substrate;a liquid LCP material is sprayed on the surface of the substrate; after the high-frequency base plate made of the LCP material is formed, the air cylinder is controlled to contract, then the limitingsliding block drives the other set of movable rods to move an ejector block on the telescopic rod upwards along the limiting sliding rod, and the manufactured high-frequency base plate is ejected out; spraying, drying and coating are effectively combined, and the efficiency of the preparation process is greatly improved.
Owner:江苏胜帆电子科技有限公司

Circuit board structure

The present invention provides a circuit board structure. The circuit board structure comprises a base plate, a plurality of metallizable photosensitive developing substrates, an electroless plated seed layer, and a second patterned circuit layer; the substrate includes an upper surface, a lower surface opposite to the upper surface, and a first patterned circuit layer; the metallizable photosensitive developing substrates are respectively disposed on the upper surface and the lower surface; each of the metallizable photosensitive development substrate includes a plurality of blind holes whichexpose at least a portion of the first patterned wiring layer; the materials of the metallizable photosensitive development substrates contain a photosensitive material; the electroless plated seed layer is disposed on the metallizable photosensitive substrates and covers the inner walls of the blind holes; and the second patterned circuit layer is disposed on the first electroless plated seed layer and fills the blind holes so as to be electrically connected with the first patterned circuit layer. According to the circuit board structure, the process steps of the circuit board structure areeffectively simplified, and the process efficiency of the circuit board structure is improved.
Owner:同扬光电(江苏)有限公司
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