Circuit board structure

Abstract

The present invention provides a circuit board structure. The circuit board structure comprises a base plate, a plurality of metallizable photosensitive developing substrates, an electroless plated seed layer, and a second patterned circuit layer; the substrate includes an upper surface, a lower surface opposite to the upper surface, and a first patterned circuit layer; the metallizable photosensitive developing substrates are respectively disposed on the upper surface and the lower surface; each of the metallizable photosensitive development substrate includes a plurality of blind holes whichexpose at least a portion of the first patterned wiring layer; the materials of the metallizable photosensitive development substrates contain a photosensitive material; the electroless plated seed layer is disposed on the metallizable photosensitive substrates and covers the inner walls of the blind holes; and the second patterned circuit layer is disposed on the first electroless plated seed layer and fills the blind holes so as to be electrically connected with the first patterned circuit layer. According to the circuit board structure, the process steps of the circuit board structure areeffectively simplified, and the process efficiency of the circuit board structure is improved.

Description

technical field [0001] The invention relates to a circuit board structure, in particular to a circuit board structure with a metallizable photosensitive and developable base material. Background technique [0002] In the current semiconductor packaging manufacturing process, the circuit board has become one of the frequently used structural components due to the advantages of fine wiring, compact assembly and good performance. The circuit board can be assembled with a plurality of electronic components, such as chips and passive components. Through the circuit board, these electronic components are electrically connected to each other, and signals can be transmitted between these electronic components. [0003] Generally speaking, a circuit board is mainly composed of multiple patterned circuit layers and multiple insulating layers laminated alternately, and the patterned circuit layers are electrically connected to each other through conductive vias. The traditional metho...

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Problems solved by technology

[0004] It is worth noting that during the above-mentioned laser drilling process, the smear that has not been completely removed by the laser will remain on the hole wall of the blind hole, so it is still necessary to remove the smear with an alkaline chemical solution. Therefore, currently The blind hole process steps are still quite complicated

Moreover, in the process of desmearing, the copper layer under the blind hole is easy to peel off in the alkaline chemical solution, thus affecting the yield of the process

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