Manufacturing method of LCP material high-frequency plate

Abstract

The invention discloses a manufacturing method of an LCP material high-frequency plate. The manufacturing method of the LCP material high-frequency plate comprises the following steps that a base plate is adsorbed and fixed through a sucker, then an air cylinder is controlled to contract and is located on the top face of a fixing box, and then a driving motor is controlled to work clockwise intermittently, so that each set of installed base plates sequentially pass through a spraying plate connected with a first raw material barrel, and a liquid film is sprayed to the surface of the base plate; after the base plate is completely coated, the coated substrate is moved to the position above an opening of a drying oven through a conveying belt, and a thin film layer is formed on the substrate;a liquid LCP material is sprayed on the surface of the substrate; after the high-frequency base plate made of the LCP material is formed, the air cylinder is controlled to contract, then the limitingsliding block drives the other set of movable rods to move an ejector block on the telescopic rod upwards along the limiting sliding rod, and the manufactured high-frequency base plate is ejected out; spraying, drying and coating are effectively combined, and the efficiency of the preparation process is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of high-frequency boards, and relates to a method for manufacturing a high-frequency board, in particular to a method for manufacturing a high-frequency board made of LCP material. Background technique [0002] For special circuit boards with high electromagnetic frequency, generally speaking, high frequency can be defined as a frequency above 1GHz. Its various physical properties, precision, and technical parameters require very high requirements, and it is often used in automotive anti-collision systems, satellite systems, radio systems and other fields. [0003] In the preparation process of the existing LCP material high-frequency board, whether it is a traditional multi-layer flexible circuit board or a multi-layer soft-hard combination board, there are generally many technological processes and complicated production. In terms of circuit board performance, power consumption and signal Increased transm...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the preparation process of the existing LCP material high-frequency board, no matter it is a traditional multi-layer flexible circuit board or a multi-layer soft-rigid board, there are generally many technological processes, complicated production, and in the circuit. In terms of board performance, there are problems such as increased power consumption and signal transmission loss; the equipment in the preparation process has low work efficiency, and it is impossible to efficiently produce multiple high-frequency boards at the same time, which makes the preparation cycle of high-frequency boards longer. Propose a manufacturing method of LCP material high-frequency board

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