Touch module and manufacturing method of touch module
A technology of touch module and manufacturing method, which is applied in the input/output process of data processing, instruments, electrical digital data processing, etc., and can solve problems such as difficult control of dispensing amount and unstable structure
Active Publication Date: 2018-08-14
WISTRON CORP +1
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Problems solved by technology
However, the amount of glue dispensing is difficult to control, and the structure may be unstable due to too little glue dispensing, and if the touch electrode layer occupies a large area of the touch substrate, the space between the flexible circuit board and the near edge of the cover glass can be stretched If the area of the gap area is too small (that is, the so-called narrow frame design), it is difficult to open a gap of sufficient width at the overlap between the flexible circuit board and the protective glass near the edge for dispensing or double-sided tape attachment
Method used
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[0037] figure 1 It is a partial perspective view of a touch module according to an embodiment of the present invention. Please refer to figure 1 , the touch module 100 of this embodiment is for example applied to a touch panel and includes a touch circuit 110 , a protection substrate 120 , a flexible circuit board 130 and a double-sided adhesive 140 . In this embodiment, the touch circuit 110 includes a first touch electrode layer 112 and a second touch electrode layer 114 . The first touch electrode layer 112 and the second touch electrode layer 114 further respectively include a first substrate and a second substrate, and the surfaces of the first substrate and the second substrate are both covered with a material such as indium tin. An oxide conductive pattern (not shown), and the ends of the conductive pattern are connected to a terminal row (not shown) on at least one side of the substrate. Wherein, the first substrate and the second substrate may be, for example, PET ...
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The present invention provides a touch module and a manufacturing method for the touch module. The touch module comprises a touch line, a protective substrate, a flexible circuit board and a double-sided tape. A conductive pattern is arranged on at least one substrate by the touch line, and tail ends of the conductive patterns are collectively connected to at least one terminal row, and a first region is defined at the terminal row; the protective substrate is bonded to the touch line, and a second region is defined on one side facing the touch line, the first region directly faces the second region, and a gap exists between the first and second regions; the flexible circuit board is provided with a press-fit portion at the tail end, and the press-fit portion is located in the gap and press-fitted to the first region, which enables the flexible circuit board to be electrically connected to the touch line; and the double-sided tape is located in the gap, and one side of the same is pasted to the press-fit portion and the other side of the same is pasted to the second region, which enables the tail end of the flexible circuit board to be securely fastened into the gap between the touch line and the protective substrate. The touch module provided by the present invention is capable of fastening the flexible circuit board onto the protective substrate when the touch line occupies a relatively large area of the protective substrate.
Description
technical field [0001] The invention relates to an electronic module and a method for manufacturing the electronic module, and in particular to a touch module and a method for manufacturing the touch module. Background technique [0002] In recent years, with the rapid development and progress of wireless mobile communications and consumer electronics, many information products have been From traditional input devices such as a keyboard or a mouse, to using a touch panel (touch panel) as an input device. In current touch panel designs, indium tin oxide (ITO) layers are mostly used as touch electrode layers, and the touch electrode layers are fabricated on glass or film touch substrates to sense touch. enter. In addition, a flexible printed circuit is arranged on the side of the touch substrate, and the terminal row of the touch electrode layer is crimped (bonded) by conductive glue to generate electrical connection, so as to transfer the power from the touch electrode laye...
Claims
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IPC IPC(8): G06F3/041
Inventor 孙曙韩闯李锋
Owner WISTRON CORP