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LED chip with vertical structure, LED surface light source and preparation method thereof

An LED surface light source and LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of large contact resistance, chip waste, device heating, etc., and achieve the effect of avoiding heating phenomenon, avoiding chip waste, and simple process

Active Publication Date: 2019-02-22
LEEDARSON IOT TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation method of the above-mentioned LED surface light source, the chip is not fixed, and its orientation in Ink is randomly distributed. When the chip is printed in the device, the P electrode of the chip is randomly distributed upward or downward, that is, it is uncertain.
When power is applied, only the chip whose P electrode is in contact with the positive layer can be turned on and lit, and the chip facing the opposite direction cannot be turned on.
[0005] Therefore, the scheme disclosed in the above-mentioned patent has the following main disadvantages: (1) due to the random distribution of the chip installation directions in the device, from the perspective of statistical distribution probability, 50% of the chips can be lighted, and the other 50% cannot be lighted, resulting in Great waste of chips; (2) The printing method cannot ensure the close contact between the conductive layer and the chip electrodes, which will form a large contact resistance and cause the device to heat up

Method used

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  • LED chip with vertical structure, LED surface light source and preparation method thereof
  • LED chip with vertical structure, LED surface light source and preparation method thereof
  • LED chip with vertical structure, LED surface light source and preparation method thereof

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preparation example Construction

[0025] A method for preparing an LED surface light source. Firstly, protruding electrodes are respectively made on the P electrode and the N electrode of at least one LED chip with a vertical structure, and then cut to form a single chip, and the single chip is encapsulated in an encapsulation material Then, the encapsulation materials on the two opposite surfaces in the vertical direction of the encapsulated single chip are thinned until the bump electrodes are exposed, and then the substrates with conductive materials are respectively pressed along the vertical direction of the single chip. On both sides of the encapsulation material, the conductive material is in contact with the protruding electrodes.

[0026] As can be seen from the foregoing description, the beneficial effects of the present invention are:

[0027] (1) In the LED chip of the vertical structure of the present invention, the first electrode and the second electrode are respectively electrically connected t...

Embodiment 1

[0052] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0053] A LED chip with a vertical structure in this embodiment includes at least three LED chips 1 with a vertical structure, and the two opposite surfaces of the LED chip 1 along the vertical direction are respectively provided with a first electrode layer and a second electrode layer, The first electrode layer is provided with a first electrode 11, the second electrode layer is provided with a second electrode 12, the first electrode 11 is electrically connected to the first electrode layer, and the second electrode 12 is connected to the second electrode layer. The two electrode layers are electrically connected, the first electrode 11 and the second electrode 12 are respectively raised electrodes, and are respectively arranged along the vertical direction of the LED chip 1, and also include an encapsulation layer 2, and the encapsulation layer 2 adopts PMMA Material. The encapsulation layer 2 c...

Embodiment 2

[0054] Please refer to figure 2 , the second embodiment of the present invention is:

[0055] An LED surface light source in this embodiment comprises at least three LED chips 1 with a vertical structure, and the two opposite surfaces of the LED chips 1 along the vertical direction are respectively provided with a first electrode layer and a second electrode layer. The first electrode layer is provided with a first electrode 11, the second electrode layer is provided with a second electrode 12, the first electrode 11 is electrically connected to the first electrode layer, and the second electrode 12 is connected to the second electrode layer. Layers are electrically connected, the first electrode 11 and the second electrode 12 are respectively raised electrodes, and are respectively arranged along the vertical direction of the LED chip 1, and also include an encapsulation layer 2, a conductive layer 3 and a base layer 4. The sealing layer 2, the conductive layer 3 and the ba...

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Abstract

The invention relates to an LED surface light source. The LED surface light source comprises at least one LED chip of a vertical structure, and an enveloping layer, wherein two opposite surfaces of the LED chip along the vertical direction are provided with a first electrode layer and a second electrode layer, respectively, the first electrode layer is provided with a first electrode, the second electrode layer is provided with a second electrode, the first electrode is electrically connected with the first electrode layer, the second electrode is electrically connected with the second electrode layer, the enveloping layer covers the LED chip, and the first electrode and the second electrode are separately exposed out of the enveloping layer. The invention also relates to a preparation method of the LED surface light source. By adopting the LED surface light source, a contact resistance between the electrodes and a conductive layer can be avoided, so that the heating phenomenon can be avoided; and in addition, the preparation method of the LED surface light source has the advantages of simple preparation process and high efficiency.

Description

technical field [0001] The invention relates to LED technology, in particular to a vertically structured LED chip, an LED surface light source and a preparation method thereof. Background technique [0002] The flexible surface light source can be attached to the surface of objects of any shape, so that the lighting can be connected to the surface of indoor objects such as building walls, furniture and decorations, and the lighting effect of "seeing the light without seeing the light" and "combining lighting and art" can be realized. To provide consumers with a better lighting experience. [0003] After years of development, LED technology has become more and more mature. At the same time, the cost has been greatly reduced. It can give full play to its cost and scale advantages and realize LED flexible surface light source lighting products with reasonable cost and stable quality. [0004] There are many methods for preparing flexible LED surface light sources in the prior ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L33/62H01L25/075
CPCH01L25/0753H01L33/38H01L33/62H01L2933/0066
Inventor 郭伟杰
Owner LEEDARSON IOT TECH INC