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Power module

A technology for power modules and power components, which is applied to output power conversion devices, support structure installations, and electrical equipment structural components, etc., can solve problems such as difficult space utilization of power modules, poor combination effect, and impact on heat dissipation efficiency.

Active Publication Date: 2016-07-06
IND TECH RES INST
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] However, in addition to using a large-area substrate to carry the power module, the heat dissipation of the power module also requires a planar heat dissipation structure. In this way, it is difficult for the power module to have a better At the same time, due to the different thermal expansion coefficients of the materials, it is also easy to cause poor bonding between the substrate carried by the power module and the heat dissipation component, which affects its heat dissipation performance

Method used

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Embodiment Construction

[0039] figure 1 is a top view of a power module according to an embodiment of the present invention. figure 2 Yes figure 1 Side view of the power module. Please also refer to figure 1 and figure 2 , in this embodiment, the power module 100 is suitable for various power devices, for example, as a frequency conversion component of a motor. The power module 100 includes a plurality of substrates 110, a plurality of power components 120, a heat dissipation assembly 130 and connection terminals 140, wherein The substrate 110 is made of ceramics, and the substrates 110 are respectively located on different planes and arranged around the axis X1, and the extension direction of each substrate 110 is parallel to the axis X1. The power elements 120 are respectively arranged on the substrate 110, which are fixed on the substrate 110 by soldering, for example, and the power elements 110 are electrically connected to each other through the wire 150, and the power elements 120 on diff...

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Abstract

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the direction parallel to the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Description

technical field [0001] The invention relates to a power module, and in particular to a three-dimensional power module with a cooling assembly. Background technique [0002] In response to the development trend of global automation and energy saving, it is necessary to use variable frequency drives and motors to meet different speed requirements. However, for traditional inverters, the interior includes power modules, drive substrates, cooling fins and many peripheral electronic components, resulting in the inverter being too bulky and heavy. Regarding the development trend of current product users, related products are developing in the direction of miniaturization, high power, and high density. [0003] Efficiency and high power density have always been the industry's requirements for frequency converters. High efficiency means reducing energy consumption, which is conducive to energy conservation, emission reduction, environmental protection, and reduction of use costs. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H05K7/20H01L25/07H01L23/367
CPCH05K7/20918H01L23/473H01L25/072H01L25/18H05K7/20927H01L2224/49175H01L2224/49111H01L2924/19107H05K7/14329H05K1/028H05K7/1432H01L25/07
Inventor 刘君恺赵玉麟
Owner IND TECH RES INST