Electronic component mounting apparatus and electronic component mounting method
A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as laser scanning time limit
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no. 1 Embodiment
[0073] In the electronic component mounting apparatus of this embodiment, in order to realize efficient tact time, it is particularly important to improve the efficiency of the imaging operation of electronic components. That is, if the head 107 does not reciprocate when imaging an electronic component, and the image required for identification of the electronic component can be obtained by passing the head 107 over the 3D sensor 113 only once regardless of the size of the electronic component, Efficient takt time. Hereinafter, imaging of an electronic component controlled by the imaging control unit 207 and the lighting control unit 209 of the control unit 135 included in the electronic component mounting apparatus according to the present embodiment will be described.
[0074] Figure 13 is to indicate that the 3D sensor 113 is Figure 9 as well as Figure 10 A diagram showing an example of the timing of exposure and illumination when a small electronic component held by ...
no. 2 Embodiment
[0081] Figure 23 It is a diagram showing an example of the horizontal positional relationship between the head 107 on which the nozzles 119 are arranged in two rows, the 3D sensor 113 , and the substrate 115 on which the electronic components are mounted. also, Figure 24 It is a diagram showing the moving path in the second embodiment until the head 107 picks up the electronic component from the feeder unit 103 and mounts it on the substrate 115 . Figure 24 The illustrated point O represents the center position of the head 107 when the electronic component is picked up. After the head 107 adsorbs the electronic component at the O point, it moves to the P point by the X-axis robot 109 and the Y-axis robots 111a and 111b. Next, the head 107 is moved from the point P to the point Q by the X-axis robot 109 . In addition, the movement from point P to point Q is a movement parallel to the X axis. Finally, the head 107 moves to the R point which is the assembly point of the el...
no. 3 Embodiment
[0087] Figure 26 It is a figure which shows the moving route in the 3rd Example until the head 107 picks up an electronic component from the feeder part 103 and mounts it on the board|substrate 115. Figure 26 The illustrated point O represents the center position of the head 107 when a small electronic component is adsorbed. After the head 107 adsorbs the electronic component at the O point, it moves to the P point by the X-axis robot 109 and the Y-axis robots 111a and 111b. Next, the head 107 moves from the P point to the Q point by the X-axis robot 109 and the Y-axis robots 111a and 111b. In addition, the movement from the P point to the Q point is a movement toward the substrate 115 on the Y-axis inclined with respect to the X-axis. Finally, the head 107 moves to the R point which is the assembly point of the electronic component by the X-axis robot 109 and the Y-axis robots 111a and 111b. The imaging of the small electronic component held by the head 107 is intermitte...
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