Backlight module and display device

A backlight module and adhesive technology, applied in lighting devices, fixed lighting devices, lighting device parts and other directions, can solve the problems of film layer structure deformation, uneven heat, wrinkles and other problems, and achieve the effect of avoiding deformation

Active Publication Date: 2016-07-13
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing display device, where the IC and the LED overlap in the vertical direction, heat will be superi

Method used

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  • Backlight module and display device
  • Backlight module and display device

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Embodiment Construction

[0026] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0027] The present invention provides a solution to the problem of layer deformation caused by uneven heat generation in existing display devices.

[0028] On the one hand, if figure 1 As shown, the embodiment of the present invention provides a backlight module, including: a plastic frame 1, a reflective film 2, and an optical component 3 (the optical component includes a plurality of functional film layers such as a light bar and a circuit). in,

[0029] The optical component 3 is set in the accommodation area formed by the top of the plastic frame 1, and a back glue 4 is arranged on the bottom side of the plastic frame 1, and the reflective film 2 is fixed to the plastic frame 1 through the back glue 4, so as to be separated from the optical componen...

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PUM

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Abstract

The invention provides a backlight module and a display device. The backlight module comprises a rubber frame, a reflecting film and an optical component; the optical component is arranged in an accommodating area which is defined by the top surface of the rubber frame; postage stamp gum is arranged on one side of the bottom of the rubber frame; the reflecting film is fixed to the rubber frame through the postage stamp gum so as to be separated from the optical component at a preset distance. In the scheme of the invention, the reflecting film is fixed to the bottom of the rubber frame through the postage stamp gum with a certain thickness, so that the reflecting film is kept at a distance from the optical component above; the heat generated by a lamp strip in the optical component is diffused at the position which is beneficial to heat dissipation of the backlight module. Therefore, the overlapped heat of an IC (Integrated Circuit) and the lamp strip in the display device is reduced; the phenomena of deformation and wrinkle caused by non-uniform heat of a film structure of the display device can be effectively avoided.

Description

technical field [0001] The invention relates to the display field, in particular to a backlight module and a display device. Background technique [0002] The heat of the display device mainly comes from two aspects, one is the heat generated by IC (Integrated Circuit) operation, and the other is the heat generated by LED light emission. The current display devices are developing in the direction of ultra-thin, narrow frame and high-definition, so the number of LEDs is increasing. At the same time, the requirement of high color gamut makes it impossible for LEDs to use conventional silicate (silicate) or YAG (yttrium aluminum garnet) ) phosphors, but RG phosphors with lower light efficiency conversion, so LEDs are the main source of heat generation for display devices. [0003] In the existing display device, where the IC and the LED overlap in the vertical direction, heat will be superimposed, making the heat uneven in the entire plane, resulting in deformation and wrinkli...

Claims

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Application Information

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IPC IPC(8): F21S8/00F21V17/10F21V29/71
CPCF21V29/713F21S8/00F21V17/10G02F1/133608G02F2202/28G02F1/133317G02F1/133628F21V29/10F21Y2115/10F21V7/05F21V15/012
Inventor 张功涛高亮邸拴虎禹璐马俊杰桑建孙海威
Owner BOE TECH GRP CO LTD
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