Inspection device and control method of the same
A technology of inspection device and control method, which is applied to measurement devices, optical devices, testing of machine/structural components, etc., can solve problems such as difficulty in removing secondary reflection noise, and achieve the effect of suppressing secondary reflection noise
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no. 1 approach >
[0077] (Hardware configuration of PCB inspection system)
[0078] refer to figure 1 , the overall configuration of the substrate inspection system according to the first embodiment of the present invention will be described. figure 1 It is a schematic diagram showing the hardware configuration of the substrate inspection system. The board inspection system includes a board inspection device 1 that inspects the state of components and solder on a printed board using captured images, and a training device 2 that generates inspection programs used by the board inspection device 1 during inspection. This substrate inspection apparatus 1 is preferably used for substrate appearance inspection in a surface mount production line (for example, component floating inspection after reflow, etc.).
[0079] The substrate inspection device 1 has a table 10 , a measurement unit 11 , a control device 12 , an information processing device 13 , a display device 14 , and a storage device (dat...
no. 2 approach >
[0115] Next, a second embodiment of the present invention will be described. Compared with the case of moving the secondary reflective object to the center of the field of view and taking pictures in the above-mentioned first embodiment, the second embodiment is characterized in that the position of the secondary reflective object in the field of view and the position of the secondary reflective object are not changed. This is the point of generating a pattern image with an appropriate projection range in accordance with the size and projecting the pattern image. Since the basic configuration of the substrate inspection system is the same as that of the first embodiment, the configuration and operations unique to this embodiment will be mainly described below.
[0116] refer to Image 6 and Figure 7 The flow of measurement and inspection by phase shift in the second embodiment will be described. Image 6 is a flowchart showing the flow of measurement and inspection, Figu...
no. 3 approach >
[0123] Next, a third embodiment of the present invention will be described. When there is a secondary reflection object in the field of view, in the first and second embodiments, imaging of the entire field of view using the normal pattern image and imaging of the secondary reflection object using the secondary reflection suppression pattern image are performed. In contrast, the third embodiment is characterized in that the entire field of view is captured using a secondary reflection suppression pattern image having a projection range where no light reaches the reflecting surface of the causative object instead of the normal pattern image. Since the basic configuration of the substrate inspection system is the same as that of the first embodiment, the configuration and operations unique to this embodiment will be mainly described below.
[0124] refer to Figure 8 and Figure 9 , the flow of measurement and inspection by phase shift in the third embodiment will be described. ...
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