FPBGA packaging substrate for radio frequency electric appliance
A technology for packaging substrates and electrical appliances. It is applied in the direction of electric solid-state devices, circuits, and electrical components. It can solve the problems of not being able to realize a large number of I/Os and large-area grounding pads at the same time, and limiting circuit performance.
Inactive Publication Date: 2016-07-20
GUANGDONG UNIV OF TECH
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Problems solved by technology
Packages with a limited number of I / Os such as LGA and MCM are especially useful in highly integrated package designs, which also limit circuit performance to a certain extent, and cannot simultaneously achieve a large number of I / Os and large-area ground pads
Method used
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Embodiment Construction
[0017] Such as figure 1 As shown, the FPBGA packaging substrate used for radio frequency electrical appliances includes a substrate body 1, and the substrate body 1 is divided into a plurality of ground pad areas 2 distributed at intervals, and each ground pad area 2 is provided with a plurality of spaced distribution The ground solder balls 3 and a plurality of signal solder balls 4 are distributed on the edge and center of the substrate body 1; the ratio of the ground solder balls 3 to the signal solder balls 4 is 1:1.6.
[0018] Specifically, a 4*4 matrix of ground solder balls is provided in the ground pad area 2 with an isolation height of 78 microns. There are 4 ground pads 2, 104 signal solder balls at the edge of the substrate body 1, and 12 signal solder balls at the center of the substrate body.
[0019] Among the ground solder balls in the 4*4 matrix, when reflow soldering, the ground solder balls in the 2*2 matrix form a single uniform large-volume solder 5, and ...
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The invention discloses an FPBGA packaging substrate for radio frequency electric appliances. The FPBGA packaging substrate comprises a substrate body, a plurality of grounding pad zones distributed spacingly are divided on the substrate body, a plurality of grounding solder balls distributed spacingly are arranged in each grounding pad zone, a plurality of signal solder balls are distributed on the edge and center of the substrate body, and the proportion of the grounding solder balls to the signal solder balls is 1:1.6. Four grounding solder balls are provided, the number of the signal solder balls on the edge of the substrate body is 104, and the number of the signal solder balls on the center of the substrate body is 12. The FPBGA packaging substrate is advantageous in that lots of I / Os and large-area metallic grounding pads are provided. Conventional LGA and MCM packaging meets the requirements of one large-area metallic grounding pad, but with less I / Os. The FPBGA packaging substrate facilitates design of highly integrated packaging, and plays a leading role in the developing antenna semiconductor industry.
Description
technical field [0001] The invention relates to an FPBGA packaging substrate used for radio frequency electrical appliances. Background technique [0002] Advanced RF electronics applications require a large number of I / Os and large area metal pads in order to achieve excellent circuit performance. Although the traditional BGA package provides enough I / Os, it lacks performance in terms of large-area metal pads. Previously, LGA and MCM packages were often used to provide limited signal pads and a large rectangular metal pad in the middle of the package, with signal pads only on the edges of the package. Packages with a limited number of I / Os such as LGA and MCM are especially useful for highly integrated package designs, which also limit circuit performance to a certain extent, and cannot simultaneously achieve a large number of I / Os and large-area ground pads. Contents of the invention [0003] In order to solve the deficiencies in the prior art, the purpose of the prese...
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IPC IPC(8): H01L23/498
CPCH01L23/49816
Inventor 陈锦涛章国豪朱晓锐区力翔余凯林俊明
Owner GUANGDONG UNIV OF TECH