Substrate supporting device

A technology for supporting devices and substrates, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to solve problems such as mutual interference or other influences between devices, inability to perform process operations, and to improve process quality and product yields , the effect of reducing the amount of bending

Inactive Publication Date: 2016-07-27
HANNSTAR DISPLAY NANJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In semiconductor technology or substrate processing technology, it is often necessary to use a substrate support device to support the glass substrate, so that the glass substrate can perform the required process. It is propped up, but the glass substrate will be bent due to the influence of gravity, and the degree of bending will be affected by the density or separation distance of these thimbles. If the bending phenomenon of the glass substrate is reduced, the thimble Density or shortening the separation distance will cause mutual interference or other influences between equipment, making it impossible to carry out process operations

Method used

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Embodiment Construction

[0018] A substrate supporting device according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference numerals.

[0019] figure 1 and figure 2 It is a schematic diagram of different states of a substrate supporting device 1 according to an embodiment of the present invention, wherein figure 1 shows the state in which the thimble of the substrate support device 1 is raised, and figure 2 A state in which the ejector pin of the substrate holder 1 is lowered is shown. The thimble in this embodiment can be connected to a driving module (not shown) to move up and down. Since the driving module is not a technical feature of the present invention and is well known to those skilled in the art, it will not be repeated here. The substrate supporting device 1 of this embodiment can be applied to support a substrate, such as a glass substrate, and can be applie...

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Abstract

The present application discloses a substrate supporting device, which includes a platform unit, a plurality of thimbles and at least one supporting component. The thimbles are arranged on the platform unit, each thimble has a top surface, and these thimbles protrude from the platform unit movably. The supporting component has a bottom surface, and the bottom surface is crimped on the top surface of some of the ejector pins.

Description

technical field [0001] The invention relates to a support device, in particular to a substrate support device. Background technique [0002] In semiconductor technology or substrate processing technology, it is often necessary to use a substrate support device to support the glass substrate, so that the glass substrate can perform the required process. It is propped up, but the glass substrate will be bent due to the influence of gravity, and the degree of bending will be affected by the density or separation distance of these thimbles. If the bending phenomenon of the glass substrate is reduced, the thimble Increasing the density or shortening the separation distance will cause mutual interference or other influences between equipment, making it impossible to carry out process operations. [0003] Therefore, how to achieve the purpose of reducing the bending of the glass substrate without increasing the number of thimbles, providing appropriate support effects to cope with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
Inventor 黄一轩
Owner HANNSTAR DISPLAY NANJING
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