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Automobile hardware modularization device

A hardware module and device technology, which is applied to vehicle components, transportation and packaging, circuits or fluid pipelines, etc., can solve the problems of difficult and limited updates of automotive hardware, and achieve the effect of easy operation and simple device structure

Inactive Publication Date: 2016-08-03
LETV HLDG BEIJING CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the invention of the embodiment of the present invention is to provide a vehicle hardware modularization device for the defects of the prior art, which is used to solve the problems in the prior art such as difficult and limited updating of the vehicle hardware

Method used

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Embodiment Construction

[0012] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0013] figure 1 Show the functional block diagram of the embodiment of the automobile hardware modularization device provided by the present invention, as figure 1 As shown, the automobile hardware modularization device includes: an automobile substrate 100 and a plurality of hardware function modules applied on the automobile substrate 100 . Multiple hardware functional modules include one or more of the following functional modu...

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Abstract

The embodiment of the invention discloses an automobile hardware modularization device and belongs to the field of intelligent automobiles. The automobile hardware modularization device comprises an automobile substrate and multiple hardware function modules applied to the automobile substrate. The automobile substrate comprises a master control circuit of the multiple hardware function modules and multiple hardware connecting interfaces. The multiple hardware connecting interfaces of the automobile substrate are connected with the multiple hardware function modules through preset connectors. By the adoption of the embodiment of the automobile hardware modularization device, multiple pieces of function hardware of an automobile are modularized according to functions, the modularized hardware modules are connected with the automobile substrate through the preset connectors, the automobile hardware modularization device is simple in structure and easy to operate, and meanwhile the problem that existing hardware is difficult to update due to the limitations of factors such as interfaces and shapes of the existing hardware is solved.

Description

technical field [0001] The embodiment of the present invention relates to the field of smart cars, in particular to a modularized device for car hardware. Background technique [0002] In addition to the driving function, the car also provides a series of auxiliary and entertainment functions that can be used by users, such as playing songs through audio, watching videos through video playback, monitoring road conditions and vehicle information during driving, and so on. The realization of these functions requires the car to provide hardware and software support. [0003] Due to the rapid development of information technology, the corresponding hardware and software versions of the car also need to be continuously upgraded to meet the ever-expanding user needs. The upgrade of the car software is relatively simple. With the help of external devices, the software version can be directly updated to complete the upgrade of the car software. However, since the car hardware is i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60R16/02
CPCB60R16/02
Inventor 李国辉
Owner LETV HLDG BEIJING CO LTD
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