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Rigid-flex circuit board and manufacturing method thereof

A combination of soft and hard, manufacturing method technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, structural connection of printed circuits, etc., can solve the problems of large alignment deviation, unfavorable high density and thin design, etc., to reduce area, reducing defects, and improving alignment

Active Publication Date: 2019-01-25
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the above problems can be solved by making the soft board first, forming it into a single piece of soft board, and then embedding it in the middle of the hard board. Embedded in the middle of the hard board, the soft board and the hard board are fixed by PIN, etc., the alignment deviation is large, which is not conducive to high-density and thin design

Method used

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  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof
  • Rigid-flex circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] The manufacturing method of the soft-rigid circuit board provided by the technical solution includes the following steps:

[0055] For a first step, see figure 1 , providing a core layer 10 and a flexible substrate 20 .

[0056] The core layer 10 includes a base layer 12 , a first copper foil 13 and a second copper foil 14 . The first copper foil 13 and the second copper foil 14 are coated on both sides of the base layer 12 respectively.

[0057] The flexible substrate 20 includes a base plate 22 and a flexible copper foil 24 formed on the surface of the base plate 22 .

[0058] The flexible substrate 20 includes a flexible region 23 . The flexible region 23 corresponds to the bending region after the subsequent rigid-flex board is formed.

[0059] The core layer 10 is pre-fractured (by drilling or scooping) to form two pre-fracture openings 19 . The two pre-slits 19 are formed on the core layer and arranged parallel to each other. The two pre-splitting openings 1...

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Abstract

The invention discloses a rigid-flex combined circuit board and a manufacturing method thereof. The rigid-flex combined circuit board comprises a flexible board and a rigid board, wherein the flexible board comprises a basic board, a flexible circuit layer formed on the surface of the basic board and a covering film covering the flexible circuit layer; the rigid board at least comprises a core layer, a first insulated layer and a second insulated layer formed at two sides of the core layer and a first conductive circuit layer and a second conductive circuit layer formed at two sides of the first insulated layer and the second insulated layer; two ends of the flexible board are embedded in the rigid board, and the un-embedded parts are exposed; and the basic board partially covers the surface of the core layer to enable the flexible board to be located on the surface of the core layer.

Description

technical field [0001] The invention relates to the field of circuit boards and their manufacture, in particular to a soft-rigid circuit board and a manufacturing method thereof. Background technique [0002] The rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of a flexible circuit board, but also have the hardness of a rigid board. At present, the traditional method of producing soft and hard boards in the industry is to operate the soft board and the hard board at the same time, that is, to press the whole soft board into the inside or one side of the hard board. In this way, the whole soft board is made in the middle of the hard board, which will increase The cost of the entire stacked material, and at the same time, when different materials are made of electroplating, it is easy to have poor holes and other phenomena, thus increasing the cost. With the current develo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36H05K3/46
Inventor 李彪
Owner AVARY HLDG (SHENZHEN) CO LTD
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