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108results about How to "Reduce adverse phenomena" patented technology

Liquid crystal display panel and preparation method thereof

The invention relates to a liquid crystal display panel and a preparation method thereof. The liquid crystal display panel comprises a first substrate and a second substrate, wherein a plurality of spacers are formed between the first substrate and the second substrate; the spacers at least comprise a first spacer and a second spacer; the thermal expansion coefficient of the material adopted by the first spacer is less than the thermal expansion coefficient of liquid crystal; the thermal expansion coefficient of the material adopted by the second spacer is greater than the thermal expansion coefficient of the liquid crystal; and the first spacer and the second spacer are arranged in a spacing mode. The preparation method comprises the following steps: respectively preparing and forming the first spacer and the second spacer on one or two substrates, and folding the two substrates to form the liquid crystal display panel. In the invention, by the combined actions of the spacers of different materials, the integral thermal expansion coefficient of the spacers is approximate to the thermal expansion coefficient of the liquid crystal, thereby enhancing the capacity of the spacers in keeping the box thickness, reducing the adverse phenomena of high-temperature gravity water ripple and low-temperature air bubbles appearing on the liquid crystal display panel, and improving the display effect.
Owner:BOE TECH GRP CO LTD +1

Sorting and grouping method for lithium ion batteries

The invention relates to the technical field of lithium ion battery manufacturing, and particularly relates to a sorting and grouping method for lithium ion batteries. The sorting and grouping method is widely applied to sorting and grouping of battery packs of various types of electronic and electrical equipment such as small digital electrical appliances, electric bicycles and electric automobiles. The sorting and grouping method comprises the following steps: firstly, spraying codes on or numbering single batteries, and collecting first capacity, voltage and internal resistance of the single batteries; and aging the single batteries, collecting second voltage, internal resistance and recovery capacity of the single batteries, carrying out data statistics on grouping factors, establishing the grading standard of each grouping factor of the single batteries, determining the level of each grouping factor of each single battery, and selecting the grouping factors according to practical conditions to carry out sorting and grouping. The sorting process is simple, the requirement on sorting equipment is simple, and thus the sorting and grouping cost is reduced; the method has the function of preferably selecting battery packs with long service life, unqualified battery cores can be eliminated, and thus undesirable effects of produced battery packs can be reduced.
Owner:DONGGUAN ADF BATTERY

Measure for enhancing electric transmission line tower footing frozen soil foundation stability

ActiveCN102817380ATo achieve the purpose of coolingSignificant engineering effectProtective foundationEarth surfaceTower
The invention relates to a measure for enhancing electric transmission line tower footing frozen soil foundation stability. The measure is characterized in that gravity type heat pipes are buried on the periphery of a tower footing foundation of an electric transmission line, heat preservation materials are distributed on a horizontal layer on the periphery of a pile end and a pile body at the top of the tower footing foundation, and soil layers densely higher than an earth surface strap gradient are built above the earth surface and surrounding tower legs of the tower footing foundation, wherein strap gradient waterproof films are paved in the soil layers. The gravity type heat pipes and the heat preservation materials are effectively combined so that the practical use quantity of the gravity type heat pipes can be greatly reduced, project investment can be greatly reduced in terms of the project, construction difficulty is reduced, and construction period of project measures is shortened. In addition, in terms of overall efficacy, compared with a hot rod single measure, the measure for enhancing electric transmission line tower footing frozen soil foundation stability manyfold improves and radically changes the overall cooling efficiency of the electric transmission line tower footing frozen soil foundation and maintain long-period stability of the tower footing foundation.
Owner:NORTHWEST INST OF ECO-ENVIRONMENT & RESOURCES CAS

Paint feeding system cleaning device and method

The invention discloses a cleaning device of a paint supply system and the method thereof. The device comprises a paint supply system cleaning device which comprises a solvent cleaning circulation system. The solvent cleaning circulation system sequentially comprises a paint pump, a paint supply pipe, a spraying gun and a counter flow pipe; the paint supply pipe is provided with a paint supply valve. The invention is characterized in that the invention also comprises a blowing and washing system which is communicated with the solvent cleaning circulation system by a first air supply valve. The invention utilizes the characteristic that the cleaning solvent is volatile and the high pressure air to blow, leads the paint supply system to be fast cleaned, ensures no or little paint slag or cleaning solvent is residual in the paint supply pipeline and the spraying gun and can meet the requirement of clean paint supply system when paints out of more different manufactures and different types are alternatively sprayed. Furthermore, the design of the structure sufficiently considers the utilization of original resource, thus having little investment and convenient installation. The mechanism used by the method is simple and easy to be installed; the cleaning solvent is saved; meanwhile, the poor phenomena such as paint mark or paint void, etc. are reduced, and the cost is reduced.
Owner:靖江市城中村投资建设有限公司

LED backlight source, backlight source module and display device

The invention discloses an LED backlight source, a backlight source module and a display device, and relates to the technical field of display. The LED backlight source comprises a substrate, a plurality of LED chips, a prism-shaped light guide structure with an refractive index of n1, and a first medium; each LED chip comprises a first light emitting surface and at least one second light emittingsurface; the first light emitting surface is located on one side, away from the substrate, of each LED chip; the plane where the second light emitting surfaces is located intersects with the substrate; the prism-shaped light guide structure is arranged between the adjacent LED chips, and is located in a space defined by two adjacent second light emitting surfaces in the adjacent LED chips; the first medium is applied between the LED chips and the prism-shaped light guide structure, and has a refractive index of n2, wherein n1 is greater than n2; and at least part of light emitted by the second light emitting surfaces of the LED chips is emitted through the light emitting surfaces of the LED backlight source after being transmitted through the prism-shaped light guide structure, and the light emitting surfaces are parallel to the plane where the first light emitting surfaces are located. Therefore, the light utilization rate and the light uniformity of the light source can be improved.
Owner:XIAMEN TIANMA MICRO ELECTRONICS

Direct contact type probe card

The present invention relates to a direct contact type probe card which is a double-plate probe card, wherein the probe card comprises the following components: a main PCB which is of a disc shape, is formed with a quadrilateral opening at the central part and is formed with FPCB contact tables on two side surfaces; a plate which is a square component formed by steel and is connected with the bottom central part of the main PCB; a plurality of probe blocks which are arranged with a plurality of probes on the upper ends of the probe blocks and are fixedly equipped on the plate and projects from the upper surface of the main PCB; an FPCB which is formed with a probe contact table on one end and is formed with a PCB contact table corresponding with the FPCB contact table of the main PCB; FPCB blocks which are respectively provided at the side surface of each probe block and has an upper surface fixedly adhibited with the probe contact table of the FPCB; and an extrusion which is used for squeezing the PCB contact platform of the FPCB and the FPCB contact platform of the main PCB. The direct contact type probe card of the invention can simplify the structure and cancel the wiring and welding position for relatively reducing the incidence of undesirable phenomena and shortening the manufacturing time.
Owner:UBPRECISION

Method for manufacturing busbar circuit board with thick conductor layer

The invention belongs to the technical field of busbar manufacturing, and aims to provide a method for manufacturing a busbar circuit board with a thick conductor layer. In the invention, depth-controlled etching and depth-controlled edge milling are respectively performed on a first processing surface and a second processing surface which are oppositely arranged in a conductor layer with required thickness for one time, an insulation bonding layer is laminated to the conductor layer respectively from the first processing surface and the second processing surface so as to process a required busbar, the conductor layer with required thickness is arranged inside a circuit board through combined actions of a series of traditional circuit board manufacturing methods, and the busbar is enabled to have functions of an installation circuit board. In addition, the mode of depth-controlled edge milling is adopted, so that the roughness of the side wall of the conductor layer is increased to a certain degree, thus a binding force between the insulation bonding layer and the conductor layer is ensured, occurrence of undesirable phenomena of board explosion and delamination is reduced as far as possible, and thus manufacturing of a busbar circuit board which is low in production cost, universal and simple in manufacturing process and capable of passing high current can be ensured.
Owner:深圳市牧泰莱电路技术有限公司
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