Method for manufacturing busbar circuit board with thick conductor layer
A manufacturing method and conductor layer technology, which are applied in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of poor bonding force between the busbar and the insulating layer, high production cost, serious etching side etching effect, etc. The effect of planarization, simple and compact structure, and reduced installation cost
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[0035] In order to make the technical problems to be solved, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0036]It should be noted that the same or similar symbols in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood ", "right" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific ...
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