Display apparatus and manufacturing method therefor

Abstract

Embodiments of the invention provide a display apparatus and a manufacturing method therefor. The manufacturing method comprises the steps of attaching a static shielding layer to an edge region of a connecting line pattern, wherein the connecting line pattern is exposed on a display panel; the static shielding layer is provided with an insulating material region; the insulating material region is in contact with the region where the connecting line pattern is located; and the other region, except the region where the connecting line pattern is located, in the edge region is in contact with a conductive material region on the surface of the static shielding layer. The display apparatus provided by the embodiments of the invention is prepared by the manufacturing method; the anti-ESD (electrostatic discharge) capability of the chip connecting line position on the edge can be improved without increasing technological processes; in addition, the formed material, including the metal static shielding layer, is non-transparent; compared with a photo-sensitive resist, the surface attaching condition of the static shielding layer is easier to detect, and surface flatness defects cannot be formed easily; and the yield and improvement of the performance of the product can be facilitated.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display device and a manufacturing method thereof. Background technique [0002] For FIC (Film Integrated Circuit, film integrated circuit) products, electrostatic discharge (Electro-Static discharge, ESD) is likely to cause damage and damage to the products. For a display device, a driver IC is an important circuit component. In practical applications, due to the requirements of the manufacturing process, a layer of photosensitive glue (photosensitive glue) will be coated on the metal terminal area of ​​the driver chip. Photosensitive adhesive can prevent metal terminals from short-circuiting in contact with conductors, but photosensitive adhesive is transparent, it is not easy to check its surface smoothness and has little effect on anti-ESD. [0003] However, at present, the anti-ESD capability of the driver chip has become one of the important reference factors for the a...

AI Technical Summary

Problems solved by technology

For example, the anti-ESD specification of driver chips currently on the market is about 2kV, but due to the constraints of existing technologies, it cannot meet the minimum certification standards for mobile terminals (generally 6-8kV), which leads to the overall performance of this type of display products decline

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