Measuring method for use in high-temperature thermal buckling transient full-field deformation process of porous sandwich panel

A process measurement and sandwich panel technology, applied in the direction of measuring devices, material thermal analysis, instruments, etc., can solve problems such as poor light conditions, inability to collect speckle images, and affect the quality of image collection, so as to improve correlation and improve experimental results. Accuracy, the effect of ensuring quality

Inactive Publication Date: 2016-08-17
INST OF MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0007] (3) Due to the closed heating environment of the furnace cavity, the light conditions are too poor to collect clear speckle images
[0008] (4) If the heating rate is too h

Method used

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  • Measuring method for use in high-temperature thermal buckling transient full-field deformation process of porous sandwich panel
  • Measuring method for use in high-temperature thermal buckling transient full-field deformation process of porous sandwich panel
  • Measuring method for use in high-temperature thermal buckling transient full-field deformation process of porous sandwich panel

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Embodiment Construction

[0036] Embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0037] Such as figure 1 As shown, a method for measuring the transient full-field deformation process of porous sandwich panels under high temperature thermal buckling:

[0038] 1) For speckle production, the surface of the sample plate is sandblasted first, and then the speckle is sprayed on the sample plate with a high-temperature paint that can withstand 800°C high temperature and mixed with an adhesive, and finally the sprayed speckle The panels were left at room temperature for 48 hours.

[0039] For 3D-DIC measurement in high temperature environment, the preparation of high temperature speckle is one of the most important factors affecting the accuracy of the experiment. If the surface of the specimen has no natural texture features, it is necessary to spray a layer of random-sized spots on the surface as speckles for matching. In the high temperature e...

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Abstract

The invention provides a measuring method for use in a high-temperature thermal buckling transient full-field deformation process of a porous sandwich panel. The method is characterized in that a non-contact optical measuring method 3D-DIC method is applied to thermal buckling experiments of sheet and sandwich panel structures, and full-field real-time measurement is performed on thermal buckling deformation. The method comprises the following steps: speckle making: spraying speckles on the surface of a sample board with high-temperature paint after sand blasting; inner and outer parameter calibration of a CCD (Charge Coupled Device) camera; image acquiring: placing a cold light source on a viewing window of a heating furnace, sticking a frosted glass plate to an optical fiber head, and controlling the heating rate to be lower than 10 DEG C/min; during acquisition, performing image acquisition by using a short-focus lens and an optical filter together; image geometric correction; three-dimensional shape reconstruction: performing calculation after geometric correction on the acquired image through the CCD camera so as to obtain a three-dimensional deformation field of the structure, and filtering the three-dimensional deformation field according to a Gaussian filter function.

Description

technical field [0001] The invention relates to a method for measuring the transient full-field deformation process of the high-temperature thermal buckling of a porous sandwich plate. Background technique [0002] Compared with normal temperature environment, it is more difficult to measure the structural deformation of porous sandwich panels under high temperature conditions. At present, the measurement of structural deformation under high temperature environment mainly includes contact and non-contact methods. Among them, contact measurement methods mainly include high temperature strain gauges and displacement sensors. Non-contact measurement methods mainly include interferometric methods, such as moiré, electronic speckle interferometry, laser speckle correlation methods, and non-interferometric methods, such as digital image correlation (DIC). [0003] Since the non-contact measurement method does not change the mechanical properties of the structure surface, it has ...

Claims

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Application Information

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IPC IPC(8): G01B11/16G01N25/00
CPCG01B11/16G01N25/00
Inventor 袁武宋宏伟黄晨光
Owner INST OF MECHANICS - CHINESE ACAD OF SCI
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