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Layer-changing wiring method and device and integrated circuit system

A first-line, line-width technology, applied in printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve problems such as large interference, poor continuity of line signal impedance, and high density of VIA holes

Active Publication Date: 2016-08-17
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When simulating according to the existing layer-changing wiring method, it is found that because the PIN pin density of BGA components is relatively high, and VIA holes are drilled on the PIN pins, the density of VIA holes is also large, and the interference between lines is relatively large. The impedance continuity of the line signal at the VIA hole is poor

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  • Layer-changing wiring method and device and integrated circuit system
  • Layer-changing wiring method and device and integrated circuit system
  • Layer-changing wiring method and device and integrated circuit system

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0049] Such as figure 1 As shown, the embodiment of the present invention provides a layer-changing routing method, which may include the following steps:

[0050] Step 101: on the PCB board, determine the position of each PIN pin in the BGA chip, and set the layer change threshold;

[0051] Step 102: within the layer change threshold range, on the PC...

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Abstract

The invention provides a layer-changing wiring method and device and an integrated circuit system. According to the method, the position of each PIN in a BGA chip is determined on a PCB; a layer-changing threshold is set; a VIA hole corresponding to each PIN is formed in the PCB within the layer-changing threshold range; the VIA holes corresponding to the PINs are adjacent; PIN pairs are determined; symmetrical GND VIAs are arranged for VIA hole pairs corresponding to the PIN pairs; a corresponding signal line is led out for each PIN in the PIN pairs; and the signal line corresponding to each PIN is subjected to layer-changing wiring through the VIA holes in the corresponding VIA hole pair. By the layer-changing wiring method and device, the impedance continuity of line signals in the VIA hole positions is effectively improved.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a layer-changing routing method, device and integrated circuit system. Background technique [0002] With the miniaturization trend of electronic products, the size of the PCB board is getting smaller and smaller, and the BGA components on the PCB board often need to change layers to achieve communication. [0003] At present, the method of layer-changing routing is mainly to punch VIA holes on the PIN pins before BGA component packaging, and hollow out the outer edge of the VIA holes, so that the lines can be changed through the VIA holes. When simulating according to the existing layer-changing routing method, it is found that because the PIN pin density of BGA components is relatively high, and VIA holes are drilled on the PIN pins, the density of VIA holes is also relatively large, and the interference between lines is relatively large. The impedance continuity of the...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/115H05K3/4038
Inventor 孙龙张春丽
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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