A vibration and shock test fixture for ccd image sensor

Abstract

The present invention discloses a CCD image sensor vibration and impact test clamp which comprises a clamp body and a cover plate. The clamp body is a cubic structure, each side of the clamp body is provided with sample placement holes for placing a CCD image sensor, and the sample placement holes in each side are in axial symmetry or central symmetry. The sample placement holes are provided with pin fixed holes, and the CCD image sensor with pins can be inserted into the pin fixed holes of the clamp body. According to the invention, the clamp body is designed as the cubic structure, the thickness of the sample placement holes of each side is 0.6 cm to 1.3 cm, a hollow structure is formed by six sides, the sample placement holes are in axial symmetry or central symmetry so as to prevent resonance in a vibration process to cause sample damage. At the same time, in the condition of the certain requirement of a sample weight by equipment, 60G to 80G high order vibration and more than 3000G impact tests are completed, and the space reversal of the clamp body is easy to realize.

Description

technical field [0001] The invention relates to a fixture used for vibration and impact tests of a CCD image sensor, belonging to the field of aerospace components. Background technique [0002] Vibration and shock tests are essential and important test contents for upgrade screening tests and reliability tests of aerospace components. The test can determine the ability of the device to withstand dynamic stress, determine the impact of vibration on the device within the specified frequency range, measure the electrical noise generated by the device under vibration conditions, and determine whether the device can be used in electronic equipment that needs to withstand moderate severe shocks middle. At present, the variety and quantity of high-grade and high-reliability components used in aerospace models are increasing. In the actual quality assurance work, you will encounter various forms, various packages, various materials and expensive components, which requires the dev...

AI Technical Summary

Problems solved by technology

For example, the base material of the CCD image sensor and the light-transmitting material of the upper cover are made of different materials, and the glass cover of the CCD image sensor is relatively brittle, which is easy to break in the force field, so the glass cover of the CCD image sensor should be specially protected ; Another example is that the glass cover and the surrounding ceramic materials are not on the same plane, which may easily lead to uneven force; in addition, the CCD image sensor also has certain requirements for electrostatic protection

Images