Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING UNIV OF TECH
- Publication Date
- 2016-09-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention is a system for monitoring the reliability of IGBT power devices, which is a multi-channel real-time monitoring based on FPGA, and can be used for monitoring the junction temperature and thermal fatigue state of the IGBT. It belongs to the field of embedded measurement technology, and is especially suitable for reliability analysis of IGBT devices and life prediction of high-power devices. Background technique
[0002] With the development of new technologies such as wind power and solar photovoltaic power generation, the requirements for power conversion circuits are getting higher and higher. getting higher and higher. Because IGBT has the advantages of simple driving, high power level, low power consumption, and good thermal stability, it is widely used in medium and high power electric energy conversion devices, and plays an important role in key fields such as new energy power generation. Working in high power mode for a long time,...