Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system

A real-time monitoring and thermal fatigue technology, applied in semiconductor working life testing, single semiconductor device testing, etc., can solve the problems of high failure damage rate and serious reliability problems of large-capacity IGBTs

Inactive Publication Date: 2016-09-07
BEIJING UNIV OF TECH
View PDF5 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with low-current IGBTs, large-capacity IGBTs have a higher fault damage rate and more serious reliability problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system
  • Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system
  • Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The invention provides a multi-channel IGBT junction temperature real-time monitoring system based on FPGA, which can realize two functions of real-time monitoring and regulation of junction temperature, and has the advantages of high precision, good stability and large measurement range. The hardware structure provided by the present invention is as follows figure 1 shown.

[0027] The core control board module adopts the EP2C20F484C8 chip of Altera's Cyclone II series, which can be programmed online. In order to meet the requirements of the module's versatility, in addition to FPGA, the core board is also equipped with SRAM, SDRAM, EPCS, etc. IGBT junction temperature and thermal fatigue real-time monitoring system monitoring and control functions. like figure 2 shown.

[0028] The data acquisition module is controlled by the host computer, and different sampling frequencies are set for different types of IGBTs. During the junction temperature measurement, the he...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a multi-path IGBT junction temperature and thermal fatigue real-time monitoring system. The system is a reliability testing system which is realized based on FPGA and is suitable for the real-time monitoring of the junction temperature of IGBT. The system selects the voltage VGE during the short circuit of the grid and collector as the temperature sensitive parameter of the IGBT, During the cooling process, the temperature sensitive parameter is measured, and by means of linear fitting and a least square method, the relation of the junction temperature and time t is deduced, and then the junction temperature is deduced reversely. The system not only can monitor the junction temperature of a device to be monitored in real time, and can accelerate the failure process of a product by means of a PID self-calibration algorithm, thereby effectively shortening the experiment time and completing the IGBT thermal fatigue experiment at the end. On the basis, over-current, over-voltage, and over-temperature protection tasks are additionally provided, and by means of alarming and automatic shutdown, the IGBT device can be protected in real time, and the thermal fatigue monitoring task can be completed. The system can be expanded and improved in functions based on the actual needs, and the function of the IGBT junction temperature and thermal fatigue real-time monitoring system can be further enriched.

Description

technical field [0001] The invention is a system for monitoring the reliability of IGBT power devices, which is a multi-channel real-time monitoring based on FPGA, and can be used for monitoring the junction temperature and thermal fatigue state of the IGBT. It belongs to the field of embedded measurement technology, and is especially suitable for reliability analysis of IGBT devices and life prediction of high-power devices. Background technique [0002] With the development of new technologies such as wind power and solar photovoltaic power generation, the requirements for power conversion circuits are getting higher and higher. getting higher and higher. Because IGBT has the advantages of simple driving, high power level, low power consumption, and good thermal stability, it is widely used in medium and high power electric energy conversion devices, and plays an important role in key fields such as new energy power generation. Working in high power mode for a long time,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2642
Inventor 张小玲任云谢雪松熊文雯陈君许迪迪
Owner BEIJING UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap