Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system

A real-time monitoring and thermal fatigue technology, applied in semiconductor working life testing, single semiconductor device testing, etc., can solve the problems of high failure damage rate and serious reliability problems of large-capacity IGBTs
CN105929316AInactive Publication Date: 2016-09-07BEIJING UNIV OF TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING UNIV OF TECH
Publication Date
2016-09-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a multi-path IGBT junction temperature and thermal fatigue real-time monitoring system. The system is a reliability testing system which is realized based on FPGA and is suitable for the real-time monitoring of the junction temperature of IGBT. The system selects the voltage VGE during the short circuit of the grid and collector as the temperature sensitive parameter of the IGBT, During the cooling process, the temperature sensitive parameter is measured, and by means of linear fitting and a least square method, the relation of the junction temperature and time t is deduced, and then the junction temperature is deduced reversely. The system not only can monitor the junction temperature of a device to be monitored in real time, and can accelerate the failure process of a product by means of a PID self-calibration algorithm, thereby effectively shortening the experiment time and completing the IGBT thermal fatigue experiment at the end. On the basis, over-current, over-voltage, and over-temperature protection tasks are additionally provided, and by means of alarming and automatic shutdown, the IGBT device can be protected in real time, and the thermal fatigue monitoring task can be completed. The system can be expanded and improved in functions based on the actual needs, and the function of the IGBT junction temperature and thermal fatigue real-time monitoring system can be further enriched.
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Description

technical field

[0001] The invention is a system for monitoring the reliability of IGBT power devices, which is a multi-channel real-time monitoring based on FPGA, and can be used for monitoring the junction temperature and thermal fatigue state of the IGBT. It belongs to the field of embedded measurement technology, and is especially suitable for reliability analysis of IGBT devices and life prediction of high-power devices. Background technique

[0002] With the development of new technologies such as wind power and solar photovoltaic power generation, the requirements for power conversion circuits are getting higher and higher. getting higher and higher. Because IGBT has the advantages of simple driving, high power level, low power consumption, and good thermal stability, it is widely used in medium and high power electric energy conversion devices, and plays an important role in key fields such as new energy power generation. Working in high power mode for a long time,...

Claims

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