Physical quantity sensor, manufacturing method thereof, electronic device, and mobile body

Abstract

The invention provides a physical quantity sensor, a manufacturing method thereof, electronic equipment and a moving body. The physical quantity sensor can reduce the possibility that the cover body is peeled off from the base body. The physical quantity sensor (100) comprises: a base body (10); a cover body (20); a functional element (102), which is arranged in a cavity (2) formed by the base body (10) and the cover body (20); a protective film (30), which continuously covers the main surface (12) of the base (10), the joint interface (4) between the main surface (12) of the base (10) and the cover (20), and the cover (20) , and the protective film (30) is an inorganic material film or an organic semiconductor film.

Description

technical field [0001] The present invention relates to a physical quantity sensor, a manufacturing method thereof, electronic equipment and a mobile body. Background technique [0002] In recent years, a physical quantity sensor that detects a physical quantity using silicon MEMS (Micro Electro Mechanical System: Micro Electro Mechanical System) technology has been developed. In particular, applications such as acceleration sensors that detect acceleration and gyro sensors that detect angular velocity are rapidly spreading, such as hand-shake correction functions for digital cameras (DSC), car navigation systems, and motion sensing functions for game consoles. [0003] In such a physical quantity sensor, a functional element is accommodated in a hermetically sealed cavity. [0004] For example, Patent Document 1 discloses a physical quantity sensor in which a functional element is arranged in a cavity formed by a base body and a cover body. In Patent Document 1, anodic bo...

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Problems solved by technology

[0006] However, in the physical quantity sensor of Patent Document 1, since the joint interface between the base and the cover is exposed, at the time of dicing the chip, water may be supplied to the joint interface between the base and the cover. (cutting water) so that the cover body is peeled off from the base body

In addition, in the physical quantity sensor of Patent Document 1, when placed in a high-temperature environment or heated during manufacture, the base and cover may be distorted due to the difference in thermal expansion coefficient between the base and cover. , so that the lid is peeled off from the substrate

[0007] In addition, in the sealing technology of Patent Document 2, although the interface between the cover member and the base is covered with resin, there is a case where the resin is generated when placed in a high-temperature environment or heated during manufacture. A case where deformation prevents adequate protection of the interface between the cover member and the base body

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