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Method for manufacturing low-temperature polysilicon thin film, thin film transistor, array substrate and display device

A low-temperature polysilicon and thin-film transistor technology, applied in transistors, semiconductor devices, electric solid-state devices, etc., can solve the problems of poor uniformity of threshold voltage and mobility of thin-film transistors, uneven distribution of grain boundaries and defects, etc.

Active Publication Date: 2018-12-18
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problem of poor uniformity of the threshold voltage and mobility of thin film transistors due to the existence of a large number of grain boundaries and defects, and the uneven distribution of grain boundaries and defects, the embodiment of the present invention provides a low-temperature polysilicon thin film fabrication method. Method, thin film transistor, array substrate and display device

Method used

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  • Method for manufacturing low-temperature polysilicon thin film, thin film transistor, array substrate and display device
  • Method for manufacturing low-temperature polysilicon thin film, thin film transistor, array substrate and display device
  • Method for manufacturing low-temperature polysilicon thin film, thin film transistor, array substrate and display device

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Embodiment Construction

[0042] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0043] figure 1 It is a flowchart of a method for manufacturing a low-temperature polysilicon thin film provided by an embodiment of the present invention, see figure 1 , the method includes:

[0044] Step 101: forming a metal pattern on the base substrate.

[0045] Wherein, the base substrate may be a glass substrate, a plastic substrate, a silicon substrate, or the like. The metal pattern may be a molybdenum Mo metal pattern or a silver Ag metal pattern.

[0046] Step 102: forming a buffer layer covering the metal pattern on the metal pattern.

[0047] Step 103: removing the metal pattern in the buffer layer, so that a cavity structure is formed in the buffer layer.

[0048] Wherein, the cavity structure refers to a hollow area ...

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Abstract

The invention discloses a manufacturing method of a low-temperature polycrystalline silicon thin film, a thin film transistor, an array substrate and a display device. The method comprises the following steps: forming a metal pattern on a substrate; forming a buffer layer with which the metal pattern is covered on the metal layer; removing the metal pattern in the buffer layer so that a cavity structure is formed in the buffer layer; and forming the low-temperature polycrystalline silicon thin film on the buffer layer. When low-temperature polycrystalline silicon is grown, the cooling velocity of the cavity structure is relatively low and is beneficial for growth after crystalline grain nucleation, so that larger crystalline grains are formed; therefore, the larger crystalline grains can be formed by designing the cavity structure, the dimensions of the crystalline grains are relatively large, and corresponding grain boundaries and defects are lesser, so that the problem of poor homogeneity of threshold voltage and migration rate for the thin film transistor caused by the existence of a plurality of grain boundaries and defects and uneven distribution of the grain boundaries and defects in the low-temperature polycrystalline silicon thin film is solved.

Description

technical field [0001] The invention relates to the field of displays, in particular to a method for manufacturing a low-temperature polysilicon thin film, a thin film transistor, an array substrate and a display device. Background technique [0002] Active Matrix / Organic Light Emitting Diode (AMOLED) display technology has become the best choice for future display technology due to its advantages of high image quality, low power consumption, wide viewing angle and ultra-light and ultra-thin. At present, the active layer of the thin film transistor in the AMOLED display technology is generally implemented by a low-temperature polysilicon thin film with high carrier mobility. [0003] Due to the existence of a large number of grain boundaries and defects in the existing low-temperature polysilicon thin films, and the uneven distribution of grain boundaries and defects, the uniformity of the threshold voltage and mobility of thin film transistors is not good, especially when t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/324H01L29/786H01L27/12
CPCH01L21/02532H01L21/02595H01L21/324H01L27/1214H01L29/78672
Inventor 李小龙高山镇刘政敏健张慧娟
Owner BOE TECH GRP CO LTD