Semiconductor device

A semiconductor and housing technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problem of reducing the self-inductance of semiconductor devices, and achieve the effect of reducing the self-inductance and easing the concentration of magnetic flux.
CN106024748BActive Publication Date: 2018-11-23MITSUBISHI ELECTRIC CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
MITSUBISHI ELECTRIC CORP
Publication Date
2018-11-23

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Abstract

The object is to provide a semiconductor device capable of reducing self-inductance. The semiconductor device has: a resin case (1), which accommodates a semiconductor element; a parallel plate (3), which is connected to the semiconductor element and arranged in the resin case (1), and is parallel to each other through an insulating material (10). and two electrodes (6, 7), which are respectively drawn out from the upper ends of the parallel plates (3), and arranged in the resin case (1) at predetermined intervals. ) on the upper surface. The upper ends of the parallel plates (3) between the two electrode lead-out parts (4a, 5a) from which the two electrodes (6, 7) lead out are respectively bent outward in directions away from each other.
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Description

Technical field

[0001] The present invention is related to reducing the self-inductance of semiconductor devices. Background technique

[0002] Regarding power modules such as IGBT modules and SiC modules, there is a structure in which a plurality of terminals (electrodes) are arranged so that the total currents of each other cancel each other and become approximately zero. In this structure, in order to reduce the self-inductance of the semiconductor device, a plurality of terminals are arranged close to each other with an insulating material interposed therebetween, or adjacent portions of the plurality of terminals are arranged in parallel (for example, refer to Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2013-21107

[0004] However, the terminals used to connect to the external circuit need to be opened from the inside of the insulating resin case to the outside. In order to ensure the creepage distance, the plurality of terminals ...

Claims

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