91results about "Zig-zag/sinusoidal resistive elements" patented technology

To improve stability of gauge characteristics in a strain gauge having a resistor formed on a substrate having flexibility.SOLUTION: A strain gauge has: a resin-made substrate having flexibility; a functional layer formed of metal, an alloy, or a compound of metal directly on one face of the substrate; a resistor having α-Cr as a main component and formed of a film including Cr, CrN, and Cr2N directly on one face of the functional layer; and an insulating resin layer covering the resistor. The functional layer has a function to promote crystal growth of the α-Cr and deposit a film having the α-Cr as a main component. The thickness of the resistor is 0.05 μm or more and 2 μm or less. The thickness of the functional layer is 1 nm or more and 100 nm or less. The coefficient of expansion of the substrate is within a range of 7 ppm / K to 20 ppm / K.SELECTED DRAWING: Figure 2

A preparation method of a polymer-derived high-temperature ceramic thin film sensor is provided. Specifically, a sensitive layer precursor layer is prepared by spraying a sensitive layer precursor liquid on an alumina substrate, and the sensitive layer precursor liquid is obtained by mixing precursor liquid with conductive powder. A protective layer precursor liquid is prepared by spraying protective layer precursor liquid on the sensitive layer precursor layer, and the protective layer precursor liquid is obtained by mixing TiB2 nano-powder, insulating powder and the precursor liquid. The protective layer precursor layer, a solder and the sensitive layer precursor layer are simultaneously pyrolyzed by a one-time pyrolysis process, and thus a protective layer, the solder joints and the sensitive layer are obtained simultaneously. Thus, there is no need to pyrolyze the sensitive layer first, saving the time for pyrolyzing the sensitive layer.

One aspect relates to a high-temperature sensor, having a coated substrate. The substrate contains a zirconium oxide or a zirconium oxide ceramic, at least one resistance structure and at least two connection contacts. The connection contacts electrically contact the resistance structure. The substrate is coated with an insulation layer. The insulation layer contains a metal oxide layer, the resistance structure and the free regions of the insulation layer, on which no resistance structure is arranged, are coated at least in regions with a ceramic intermediate layer, and a protective layer and / or a cover is arranged on the ceramic intermediate layer. At least one opening is formed in the insulation layer, which exposes at least sections of a surface of the substrate.

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

A flexible conductive element (1) comprising at least one insulating layer (2) and at least one conductive track (4) fixed to the at least one insulating layer (2), wherein the conductive track (4) has a plurality of stretches (3), and wherein the adjacent stretches of said plurality of stretches (3) have a different orientation one another, and wherein said insulating layer (2) is made of a thermoplastic polymeric material; wherein said adjacent stretches (3) are joined with a radius of curvature greater than 0.5 mm.

A battery pack according to one embodiment of the present invention includes: a battery module in which a plurality of battery cells are mounted; and a discharge member electrically connected to the battery module, wherein the discharge member includes: a frame member having an open upper portion and containing coolant; a top cover for covering the upper portion of the frame member; and a resistor mounted in the frame member, wherein both ends of the resistor are exposed to the outside of the discharge member and electrically connected to the battery module.

The invention relates to a resistor structure comprising at least an electrically insulating substrate in a cylindrical form, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path directly or indirectly and at least partially provided on the substrate and directly or indirectly joined to the terminal, the resistive path running helically at least partially along the cylindrical form of the substrate and comprising at least one resistive trace, characterized in that the geometry in connection with the resistive path is configured such that an intensity of the electrical field is at least in parts reduced.

The present invention provides a resistance alloy for a shunt resistor, an application of the resistance alloy to the shunt resistor, and a shunt resistor using the resistance alloy. In a resistor for current detection such as a shunt resistor, a low TCR can be maintained, a low resistivity can be achieved, and a small thermoelectric potential to copper can be achieved. The resistance alloy is used for a shunt resistor for current detection, and the manganese in the resistance alloy is 4.5 to 5.5% by mass, the silicon is 0.05 to 0.30% by mass, the iron is 0.10 to 0.30% by mass, and the remainder is composed of copper, and the resistivity is 15 to 25 μΩ·cm.

The utility model provides a linear resistor which comprises a hollow aluminum shell, insulation supporting sheets are uniformly arranged in the aluminum shell, a resistance wire is arranged in the aluminum shell in a snake shape, the resistance wire is arranged in the insulation supporting sheets in a penetrating mode, the resistance wire is provided with a first connector and a second connector which extend to the outer side of the aluminum shell, and the first connector is connected with the second connector. The aluminum shell is filled with quartz sand; according to the utility model, a certain distance is kept between the resistance wire and the aluminum shell through the supporting effect of the uniformly arranged insulating supporting sheets on the resistance wire in the aluminum shell, and the resistance wire cannot be in contact with the aluminum shell due to the supporting effect of the insulating supporting sheets when the resistance wire is loosened, so that electric leakage is avoided, and potential safety hazards are reduced; and the normal use of the resistor is ensured.

A current detection device (30) includes a resistance element (5), and a pair of electrodes (6, 7). The current detection device (30) has a projecting portion (11). The projecting portion (11) has a portion of the resistance element (5) and portions of the pair of electrodes (6, 7). The electrodes (6, 7) have first wall portions (66b, 67b) forming a portion of the projecting portion (11), and second wall portions (66a, 67a) forming the portion of the projecting portion (11). The electrodes (6, 7) have detection areas (66, 67) demarcated by the first wall portion (66b, 67b), the second wall portion (66a, 67a), a leading end portion (66c, 67c), and a contact surface (6a, 7a). The electrodes (6, 7) have voltage detecting portions (20, 21). The voltage detecting portions (20, 21) are arranged in the detection areas (66, 67) with a gap between the leading end portions (66c, 67c).

The invention discloses a load resistor device. The load resistor device comprises an insulating bracket and a resistor rope, the insulating bracket comprises two panels which are arranged side by side at an interval; a plurality of rope penetrating holes through which the resistance rope can penetrate are formed in the panels; the resistance rope penetrates through the panel rope penetrating hole back and forth, the resistance rope comprises a heat-resisting main rope and a resistance wire, and the resistance wire is spirally wound on the heat-resisting main rope. When the load resistance box works, the resistance rope penetrates through the panel back and forth, heat is generated when the resistance rope works, the heat-resistant main rope is arranged to be of a main body structure, and the heat-resistant main rope can keep stable in size when the load resistance box works and is small in size change due to expansion caused by heat and contraction caused by cold by utilizing the heat-resistant performance of the heat-resistant main rope; after long-time use, good dimensional stability can be maintained, and short circuit between the resistance wires on the adjacent resistance ropes is avoided.

To miniaturize a plane shape of a strain gauge having four resistance parts constituting a Wheatstone bridge circuit.SOLUTION: A strain gauge includes a resin flexible base material, and a resistor, wherein the resistor includes a first functional layer formed from metal, an alloy or a metallic compound directly on one surface of the base material, a first resistance part and a second resistance part which are formed from a film containing Cr, CrN and Cr2N and contain α-Cr as a main component, directly on one surface of the first functional layer, a second functional layer formed from metal, an alloy or a metallic compound directly on the other surface of the base material, and a third resistance part and a fourth resistance part which are formed from a film containing Cr, CrN and Cr2N and contain α-Cr as a main component, directly on one surface of the second functional layer, wherein the first functional layer and the second functional layer have a function for promoting crystal growth of α-Cr and film-forming the film containing α-Cr as a main component, and the first resistance part, the second resistance part, the third resistance part and the fourth resistance part constitute a Wheatstone bridge circuit.SELECTED DRAWING: Figure 3

To provide a circuit board capable of reducing the electric field strength near a high potential electrode.SOLUTION: A circuit board according to the present invention includes an insulation board, a thin film resistor (1) arranged on the surface of the insulation board, electrodes (3a, 3b) electrically connected to both sides of the thin film resistor, and the thin film resistor is formed in a pattern in which a resistance wiring (5) is repeatedly folded back, and a dummy wiring (6) for reducing the electric field strength is formed on the electrode side having a high potential.SELECTED DRAWING: Figure 1

Conductive lines (34) formed by a metal coating deposited on the insulating surface in a thermal spray manner are retreated. In order to compensate for a final resistance deviation caused by a coating thickness difference or a coating structure difference, the line width (36) is adjusted after the line is made. The adjustment of the line width can be carried out on an adjustment section (39) arranged along the length of the conductive line, or over the entire line length.

To provide a resistor capable of evenly suppressing an increase in temperature of a resistive element.SOLUTION: A resistor A30 includes a resistive element 10, an insulation plate, and a pair of electrodes 50. Each of the pair of electrodes 50 includes a bottom portion 51 positioned opposite to the insulation plate with respect to the resistive element 10 in a thickness direction. The resistor 10 includes a pair of first resistors 101 spaced apart from each other in the first direction x, a second resistor 102 located between the pair of first resistors 101, and a pair of connection portions 103 connected to the pair of first resistors 101 while being in contact with the pair of electrodes 50. When viewed in the thickness direction, each of the pair of first resistors 101 overlaps with one of the bottom portions 51 of the pair of electrodes 50. A maximum width w1max of a conduction path in each of the pair of first resistors 101 is narrower than a minimum width w2min of a conduction path in the second resistors 102.SELECTED DRAWING: Figure 23

The present invention provides a shunt resistor that can easily reduce resistance. The shunt resistor includes a first resistor 10; two substrates 11 that clamp the first resistor 10 and are joined to the first resistor 10 by welding Y1; and a second resistor 12 that is joined to the two substrates 11 at a position different from the first resistor 10 by welding Y2. The second resistor 12 is in contact with the first resistor 10 and is joined to the two substrates by welding Y2.

The invention relates to a resistor (1), in particular a snubber shunt (1) for damping voltage spikes, with a resistive element (9) made of a resistive material, wherein the resistive element (9) has a meandering shape with at least one deflection region (12) with a deflection of the current flow direction. The invention provides that the resistive element (9) in the deflection region (12) consists at least partially of a conductor material (e.g., copper) that has a higher specific electrical conductivity than the resistive material, so that the current-carrying cross-section of the resistive element (9) in the deflection region (12) consists at least partially of the conductor material.

The utility model relates to the technical field of resistors, in particular to a column-type wire-wound resistor, which comprises a first disc body and a second disc body which are arranged in parallel at intervals, and a first support column is arranged between the first disc body and the second disc body; a plurality of insulated supporting plates are arranged on the opposite side portions of the first disc body and the second disc body in the circumferential direction at intervals. Each supporting plate is provided with a plurality of threading rings which are arranged at intervals in the length direction of the supporting plate. The flexible resistance wire alternately bypasses the threading rings of the supporting plates of the first disc body and the second disc body, the resistance wire is arranged in a plurality of wave shapes, and the plurality of wave shapes are distributed in the length direction of the supporting plates; and two adjacent wave crests are arranged in a staggered manner in the length direction of the supporting plate. Compared with the prior art, the heat dissipation effect is good, the two adjacent wave-shaped wave crests are arranged in the length direction of the supporting plate in a staggered mode, the mutual heating influence of the resistance wires is reduced through the inner and outer adjacent staggered mode, meanwhile, the inductance can be reduced, and even the non-inductance effect can be achieved.

Disclosed is a contact element (100), in particular a contact plate, comprising: - a first contact element side (100a) with a contact element contact section (100') which is designed to come into contact, directly or via an intermediate element for introducing heat into the contact element (100) by means of heat conduction, with a cooling element contact section (101') or with one or more heat-generating switching means (102) of an electrical resistor; - a second contact element side (100b) for transferring the heat to a coolant. Furthermore, a cooling element, a cooling circuit element and a coolable resistor are disclosed.

The present invention relates to a sensor element (1) for measuring temperature, comprising a carrier (2), a temperature-dependent resistor (10) arranged on a top surface (2a) of the carrier (2), and a shunt resistor (20) arranged on the top surface (2a) of the carrier (2), wherein the temperature-dependent resistor (10) comprises a first electrode (12), a second electrode (13), and a functional layer (11) made of a material with a temperature-dependent electrical resistance, wherein the first and second electrodes (12, 13) are thin-film electrodes, and the functional layer (11) is a thin film, wherein the shunt resistor (20) is electrically connected to at least one of the electrodes (12, 13) of the temperature-dependent resistor (10), and wherein the shunt resistor (20) is formed by a thin film. A further aspect relates to a method for manufacturing the sensor element.

The present invention relates to a load bank (1) comprising a support frame (12) and several load bank resistance modules (9) attached to the support frame (12). Each load bank resistance module (9) comprises an electrically non-conductive support plate (10) and several heating resistors designed as tubular heating elements (11), each with a heat dissipation tube (20) having straight tube sections (20a) and at least one curved tube section (20b). The tubular heating elements (11) are each attached to one of the electrically non-conductive support plates (10). The support frame (12) has a corresponding module opening (23) for each load bank resistance module (9), which is dimensioned such that the heat dissipation tubes (20) of a load bank resistance module (9) can pass through the module opening (23) and the support plate (10) of a load bank resistance module (9) overlaps the corresponding module opening (23).The load bank resistance modules (9) are each attached to the support frame (12) by means of the electrically non-conductive support plates (10) of the load bank resistance modules (9) being attached to the support frame (12), such that the support frame (12), together with the support plates (10), separates a heat dissipation area (13) from a contact area (14). The contact points (19) are arranged in the contact area (14). The straight pipe sections (20a) of the heat dissipation pipes (20) are arranged horizontally in the heat dissipation area (13) with respect to their longitudinal extent.

The invention discloses a contact element (100), in particular a contact plate, having: a first contact element side (100a) with a contact element contact portion (100') which is designed to come into contact, directly or via an intermediate element for introducing heat into the contact element (100) by means of heat conduction, with a cooling element contact portion (101') or with one or more heat-generating switching means (102) of an electrical resistor; and a second contact element side (100b) for dissipating the heat to a coolant. The invention also discloses a cooling element, a cooling circuit element and a coolable resistor.

The invention relates to a resistor structure comprising at least one electrically insulating substrate, at least one electrically conductive terminal disposed directly or indirectly on the substrate, at least one resistive path comprising at least one resistive trace disposed directly or indirectly on the substrate and connected directly or indirectly to the terminal, wherein the thickness of the resistive trace is the thickness of the resistive trace in the thickness direction away from the substrate, at least one insulator element is applied directly or indirectly and at least partially to the substrate, and wherein the thickness of the insulator element is the thickness of the insulator element in the thickness direction away from the substrate.

The utility model discloses a composite transition resistor for an on-load tap-changer, which comprises four layers of mounting frames, a connecting plate I, a connecting plate II, a connecting plate III and a connecting plate IV, three layers of ceramic chips are mounted in each layer of mounting frame, a layer of resistance wire sheet is respectively arranged between two adjacent layers of ceramic chips, and a spring sheet is arranged outside each layer of mounting frame; the upper end and the lower end of the first connecting plate are pressed on the left outer wall of the first-layer mounting frame and the left outer wall of the second-layer mounting frame through fasteners respectively. The upper end and the lower end of the second connecting plate are pressed on the left outer wall of the third-layer mounting frame and the left outer wall of the fourth-layer mounting frame through fasteners respectively. The upper end and the lower end of the third connecting plate are pressed on the right outer wall of the second-layer mounting frame and the right outer wall of the third-layer mounting frame through fasteners respectively. The upper end and the lower end of the fourth connecting plate are pressed on the outer wall of the right side of the first-layer mounting frame and the outer wall of the right side of the fourth-layer mounting frame through fasteners respectively. The fastening device is simple in structure, reliable in fastening and low in cost.

The utility model discloses a protection device for an extra-high voltage flexible direct current power transmission system, and solves the problem that in a protection device for a power transmission system, a resistor element is easily affected by external force and damaged, or stress is generated in the resistor element to affect the resistance value, so that the large current deformation resistance and the high voltage electric field of the resistor element are not uniform. The device comprises a resistor combination structure and an inter-stack connection pipeline, wherein the resistor combination structure comprises a plurality of resistor boxes; the plurality of resistor boxes comprise a plurality of in-box resistor modules, each in-box resistor module comprises a plurality of resistor units, a plurality of U-shaped metal resistor bodies are connected in series in each resistor unit to form a continuously bent strip, the through-flow section of the resistor is large, the through-flow capacity of large current is improved, meanwhile, the process of punching a resistor disc is abandoned, the utilization rate of a resistor material is improved, and the cost is reduced. The production cost is reduced, the competitiveness of the product is improved, and meanwhile, the insulators are arranged between the resistor units, so that the attraction effect between the resistor units can be prevented.

The object is to provide a chip resistor capable of handling high power. The chip resistor disclosed herein comprises an insulating substrate (11), a pair of electrodes (12), and a resistor (13). A pair of electrodes (12) are provided at both ends of the upper surface of the insulating substrate (11). The resistor (13) is provided on the insulating substrate (11) and is connected to the pair of electrodes (12). The insulating substrate (11) has a first region (11a) in its central portion and second regions (11b) at both ends of the first region (11a). A recess (20) is provided in the first region (11a) of the insulating substrate (11). The resistor (13) formed in the first region (11a) is serpentine in a plan view. At least a portion of the resistor (13) is buried in the recess (20). A trimming groove (14) is provided in the resistor (13) formed in the second region (11b).

A resistor structure includes at least an electrically insulating substrate, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path comprising at least one resistive trace directly or indirectly provided on the substrate and directly or indirectly joined to the terminal, wherein a thickness of the resistive trace is the thickness of the resistive trace in the thickness direction facing away from the substrate, characterized in that at least one insulator element is applied directly or indirectly and at least partially on the substrate, wherein a thickness of the insulator element is the thickness of the insulator element in the thickness direction facing away from the substrate.

A resistor structure includes at least an electrically insulating substrate in a cylindrical form, at least one electrically conductive terminal directly or indirectly provided on the substrate, at least one resistive path directly or indirectly and at least partially provided on the substrate and directly or indirectly joined to the terminal, the resistive path running helically at least partially along the cylindrical form of the substrate and comprising at least one resistive trace, wherein the geometry in connection with the resistive path is configured such that an intensity of the electrical field is at least in parts reduced.