electronic device
A technology of electronic devices and heat dissipation devices, which is applied in the direction of projection devices, electrical components, and structural parts of electrical equipment, etc. It can solve problems such as heat dissipation, high-frequency noise of small-diameter fans, and large heat generation, so as to improve user experience and good heat dissipation , easy to carry effect
Inactive Publication Date: 2018-05-18
QISDA SUZHOU +1
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Problems solved by technology
In the current industry, one of the main problems that plagues the development of miniaturized / portable electronic devices is heat dissipation. Excessive temperatures generated during the operation of electronic devices will affect the service life of small electronic devices
Heat dissipation fins are a commonly used heat dissipation tool. However, in high-power small electronic devices, due to the large amount of heat generated, it cannot meet the heat dissipation requirements.
[0003] Therefore, in order to meet the heat dissipation requirements, the conventional practice in the industry is to add a small-diameter fan inside the small electronic device. When the temperature of the electronic device is high, the small-diameter fan operates at a high speed to produce better heat dissipation. The high-speed rotation will produce high-frequency noise, which poses a challenge to the quietness of small electronic devices and causes troubles for users
Method used
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[0030] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.
[0031] see Figure 1 to Figure 8 as shown, figure 1 It is a schematic diagram of the assembly process of the body 11 and the second heat dissipation structure 12 of the electronic device 100 proposed by the embodiment of the present invention, figure 2 is a partial structural diagram of the electronic device 100 in the second state proposed by the embodiment of the present invention, image 3 is a top view of the electronic device 100 proposed in the embodiment of the present invention in the second state, Figure 4 is a schematic diagram of the bottom structure of the body 11 of the electronic device 100 proposed by the embodiment of the present invention, Figure 5 It is a schematic diagram of installing or dismounting the first heat sink 10 and the third heat s...
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The invention discloses an electronic device. The electronic device comprises a body, a first heat dissipating device and a second heat dissipating device; at least one heating unit and first space are arranged in a shell of the body, and the first space is adjacent to the heating units; the electronic device can be in a first state or a second state, when the electronic device is in the first state, the body is matched with the first heat dissipating device, and the first heat dissipating device is contained in the first space to dissipate heat of the heating units, and the electronic device in the first state is convenient to carry; when the electronic device is in the second state, the first heat dissipating device is separated from the body, the body is matched with the second heat dissipating device, a first guide structure penetrates through a first through hole to stretches into the first space, and airflow flows into the body by means of the first guide structure to dissipate the heat of the heating units, wherein the size of a first fan is larger than that of the first space.
Description
technical field [0001] The invention relates to an electronic device, in particular to a small electronic device with low noise. Background technique [0002] Currently, electronic devices are generally developing toward miniaturization and portability, and thus their volumes are getting smaller and smaller. At present, one of the main problems that plagues the development of miniaturized / portable electronic devices in the industry is heat dissipation. Excessively high temperatures generated during the operation of electronic devices will affect the service life of small electronic devices. Heat dissipation fins are a commonly used heat dissipation tool. However, in high-power small electronic devices, due to the large heat generation, it cannot meet the heat dissipation requirements. [0003] Therefore, in order to meet the heat dissipation requirements, the conventional practice in the industry is to add a small-diameter fan inside the small electronic device. When the te...
Claims
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IPC IPC(8): H05K7/20G03B21/16
CPCG03B21/16H05K7/20136
Inventor 林志颖
Owner QISDA SUZHOU