Grazing angle plasma processing for modifying a substrate surface

Abstract

Embodiments of the disclosure provide apparatus and methods for modifying a surface of a substrate using a plasma modification process. In one embodiment, a process generally includes the removal and / or redistribution of a portion of an exposed surface of the substrate by use of an energetic particle beam while the substrate is disposed within a particle beam modification apparatus. Embodiments may also provide a plasma modification process that includes one or more pre-planarization processing steps and / or one or more post-planarization processing steps that are all performed within one processing system. Some embodiments may provide an apparatus and methods for planarizing a surface of a substrate by performing all of the plasma modification processes within either the same processing chamber, the same processing system or within processing chambers found in two or more processing systems.

Description

[0001] background of invention technical field [0002] Embodiments of the disclosure provided herein generally relate to apparatus and methods for planarizing non-uniform surface topography found on substrate surfaces. Background technique [0003] Integrated circuits are typically formed on substrates, especially silicon wafers, by sequentially depositing conductive, semiconductive or insulating layers. After each layer is deposited, each layer is etched to create circuitry features. As a series of layers are sequentially deposited and etched, the outer or uppermost surface of the substrate (ie, the exposed surface of the substrate) becomes increasingly uneven. FIG. 1A is a cross-sectional view of a device structure 100 having a non-planar surface 120 formed on a substrate 112 . The device structure 100 can include a patterned layer 114 formed on the surface of the substrate 112 and a deposited layer 116 formed on the patterned layer 114 and above the substrate 112 . ...

AI Technical Summary

Problems solved by technology

Further, in CMP applications that generate toxic by-products or toxic waste, due to toxic materials (such as InGaAs material, GaAs material) in the polished layer, the substrate and Handling of contaminated system components becomes a larger safety and / or consumable cost issue

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